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Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
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Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
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EPTE Newsletter
Column from: Dominique Numakura
The EPTE Newsletter from Japan ran from 2014–2021 and was brought to you by Dominique Numakura, the founder and managing director of DKN Research. Prior to this column, he worked for circuit board businesses and packaging material businesses more than 25 years. Dominique developed many advanced technologies in high-density substrates and materials over the last decade. He wrote over 100 articles for major conferences and magazines, and he is the author of several books on electronic packaging technologies. He earned his master's degree in physical chemistry and nuclear chemistry from Ibaraki University, Japan.