-
-
News
News Highlights
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
The Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Estimated reading time: Less than a minute

The Short Scoop: Introduction to Stencil Printing
Approximately 50% of defects that occur on an SMT assembly line can be attributed to the printing process. Doesn’t it seem odd, then, that instead of focusing on quality and experienced technical support, stencils have become a commodity and are being sold by a broad range of stencil suppliers, sometimes solely on the basis of price? At the same time, we continue to see more challenging requirements for stencil performance, driven by the continuous miniaturization of packages and components. Many different types of stencils are available today from many different suppliers, but not all stencils are created equal. And because the industry operates in a quick-turn, dynamic environment, industry lead-times for delivery, in many cases, are as important as the stencil’s capabilities.
Stencils range from the fairly straight-forward technology of a laser-cut stencil manufactured on some form of stainless steel material, to the high-end full-nickel electroformed stencil, along with many versions and variations in between. Stencil selection depends on the specific technology required for an application.Read the full column here.Editor's Note: This column originally appeared in the May 2013 issue of SMT Magazine.
More Columns from The Short Scoop
Adapting Stencils to Manufacturing Challenges in 2015The Short Scoop: Stencil Printing in PCB Cavities
The Short Scoop: Printing Two-level PCBs in One Step with a 3D Electroform Stencil
The Short Scoop: Improving Stencil Printing Results
The Short Scoop: More Stencil Questions (and the Answers!)
The Short Scoop: Selecting a Stencil Frame
The Short Scoop: Screen Printing Solutions for Small Die & Precision
The Short Scoop: 10 Common Stencil Questions