The Short Scoop

April 08, 2015

Adapting Stencils to Manufacturing Challenges in 2015

Rachel Miller-Short reviews the stencil industry in 2014 - including market growth, technology developments, and challenges - and talks about what to expect and new trends happening this year.

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January 14, 2015

The Short Scoop: Stencil Printing in PCB Cavities

Reservoir flux and solder paste printing can be done in one step with a 3D electroform stencil, but additional studies and techniques need to be explored to achieve the best result.

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January 06, 2015

The Short Scoop: Printing Two-level PCBs in One Step with a 3D Electroform Stencil

The requirements for two-level PCBs with components on both levels have seen a recent increase. Stencil printing on both levels requires special stencil and squeegee blade designs. Recently, Columnist Rachel Miller-Short participated in two experiments. The purpose was to determine if a 3D electroform stencil, in just one printing step, could be used to print a two-level board with cavities.

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September 24, 2014

The Short Scoop: Improving Stencil Printing Results

A myriad of causes can result in poor print performance. The problem may stem from an inferior or worn-out stencil, but the issue may also be caused by an improper aperture design or stencil thickness. Poor print performance might not be caused by the stencil itself, but rather an improper printer set-up, a non-optimal squeegee blade, or the rheology of the solder paste being used.

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July 30, 2014

The Short Scoop: More Stencil Questions (and the Answers!)

Rachel Miller-Short's March column, "10 Common Stencil Questions," brought in a slew of new questions from readers. In this edition of "The Short Scoop" she addresses a few of those inquiries. Take a look: Do you know the answers?

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July 02, 2014

The Short Scoop: Selecting a Stencil Frame

One part of stencil selection that is often overlooked, but is also quite necessary, is the selection of the frame. This month's column from Rachel Miller-Short takes a look at the stencil frame and the options to consider when specifying the frame required for your printing process and needs.

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May 14, 2014

The Short Scoop: Screen Printing Solutions for Small Die & Precision

This month, Columnist Rachel Miller-Short discusses one of her more demanding customer applications. As discussed in previous articles, when selecting stencils, the trick is choosing the right tool for the right job; but sometimes the need for tailoring a stencil for a specific application can take a bit more engineering time and several iterations to get the desired results.

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April 16, 2014

The Short Scoop: 10 Common Stencil Questions

Today a wide range of stencils and stencil technologies are available and many questions arise when the time comes to select one. Stencil users who optimize the correct stencil technology for their specific application and processing parameters enjoy greater yields and significantly lower rework. As always, it is about selecting the right tool for the job.

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February 05, 2014

The Short Scoop: Electroformed Stencils

The continued drive in electronics to place increasingly smaller components on boards poses continuing challenges to board manufacturers. Tight pad spacing, as well as placement of small 0201 and 01005 components, is becoming more commonplace on assemblies. Rachel Short says you can meet the challenges of paste application for difficult assembly printing processes by using electroformed stencils.

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January 08, 2014

The Short Scoop: Why the Customer-Stencil Manufacturer Relationship Matters in 2014

The stencil market has certainly changed over the past few years, but the main change isn't with products and technologies--although there have been several innovations in products and their accompanying technologies. The big change is in the customer-stencil manufacturer relationship, requirements, and expectations.

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November 20, 2013

The Short Scoop: Stencils for QFNs

QFNs present many challenges to the assembly printing process, but the short scoop is that with proper stencil design, correct stencil technology selection (laser, electroform, and nano-coat), and consideration for the effects of PCB soldermask layout choices, these challenges can be overcome.

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October 16, 2013

The Short Scoop: Step Stencils, Part 2 - Applications and Solutions

Columnist Rachel Short writes: "In my last column, 'The Ins and Outs of Step Stencils, Part 1,' you heard a little about step stencils--what they are, why demand is increasing, different types, and what to look for. In this column, we explore step stencil applications and solutions."

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September 11, 2013

The Short Scoop: The Ins and Outs of Step Stencils

Today, fine-pitch components, which necessitate a thin stencil for acceptable paste release, are sandwiched beside a variety of devices and components that require higher paste height. Getting the solder paste volume needed for larger components, while still having an area ratio that allows for good paste release on small components, can be challenging.

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July 03, 2013

The Short Scoop: Squeegee Blades

One often overlooked component of the soldering process is the squeegee blade, which is critical in solder paste application. The technology of the seemingly simple squeegee blade is as important as the stencil when it comes to the printing process. The application, type of stencil, and the printer set-up should all be determining factors in selecting the blade.

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June 19, 2013

The Short Scoop: Introduction to Stencil Printing

Many different types of stencils are available today from many different suppliers, but not all stencils are created equal. And because the industry operates in a quick-turn, dynamic environment, industry lead-times for delivery, in many cases, are as important as the stencil's capabilities.

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February 05, 2014

Electroformed Stencils

The continued drive in electronics to place increasingly smaller components on boards poses continuing challenges to board manufacturers. Tight pad spacing, as well as placement of small 0201 and 01005 components, is becoming more commonplace on assemblies. Rachel Short says you can meet the challenges of paste application for difficult assembly printing processes by using electroformed stencils.

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October 03, 2014

Improving Stencil Printing Results

A myriad of causes can result in poor print performance. The problem may stem from an inferior or worn-out stencil, but the issue may also be caused by an improper aperture design or stencil thickness. Poor print performance might not be caused by the stencil itself, but rather an improper printer set-up, a non-optimal squeegee blade, or the rheology of the solder paste being used.

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September 05, 2014

More Stencil Questions (and the Answers!)

Rachel Miller-Short's March column, "10 Common Stencil Questions," brought in a slew of new questions from readers. In this edition of "The Short Scoop" she addresses a few of those inquiries. Take a look: Do you know the answers?

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July 02, 2014

Selecting a Stencil Frame

One part of stencil selection that is often overlooked, but is also quite necessary, is the selection of the frame. This month's column from Rachel Miller-Short takes a look at the stencil frame and the options to consider when specifying the frame required for your printing process and needs.

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May 14, 2014

Screen Printing Solutions for Small Die & Precision

As discussed in previous articles, when selecting stencils, the trick is choosing the right tool for the right job; but sometimes the need for tailoring a stencil for a specific application can take a bit more engineering time and several iterations to get the desired results.

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April 16, 2014

10 Common Stencil Questions

There are a wide range of stencils and stencil technologies available and many questions arise when the time comes to select one. This month’s The Short Scoop answers the 10 most common questions our customers ask.

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