-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Polar Instruments Launches New Language Versions of The Speedstack PCB Layer Stackup Design System
August 18, 2015 | Polar InstrumentsEstimated reading time: 1 minute
Key Facts:
- Accurate PCB stackup data can be shared between OEM designers and
- PCB fabricators in the local language of key markets
- Increases the ease of use for customers in Germany, Japan and China
- Exports stackup documentation in a range of industry-standard formats
- Supports fast optimisation of PCB costs and manufacturing yields
- Consistent communication throughout the supply chain
Polar Instruments - a specialist provider of tools for high speed PCB design, fabrication and test - has launched new language versions of Speedstack, the industry’s best-selling PCB layer stackup design system. In addition to English, Speedstack is now available in German, Japanese, simplified Chinese and traditional Chinese versions.
“Customer demand was a strong factor in our decision to offer Speedstack in multiple language versions,” explains Martyn Gaudion, CEO of Polar Instruments. “One of the key strengths of the Speedstack system is its ability to accurately document detailed specifications for each layer in a PCB stackup. Providing OEM designers and PCB fabricators with the ability to share these specifications in their local language further enhances the speed and ease of using the Speedstack system for PCB stackup design.”
Speedstack is already licensed with OEM designers, PCB technologists and PCB fabricators worldwide, providing an ultra-fast process for creating and accurately documenting stackups for High-Density Interconnect (HDI) and flex-rigid PCBs. The system also allows PCB fabricators to fine-tune the stackup design by assessing the impact of different PCB materials on cost, performance and manufacturing yield. The accurate stackup data generated by Speedstack can be exported in different industry-standard formats and shared with companies throughout the PCB supply-chain.
About Polar Instruments
Polar Instruments is a market leader in design and manufacturing tools to simplify and enhance the design, fabrication and testing of printed circuit boards (PCBs). Their innovative tools include the industry-standard Controlled Impedance Test System (CITS) which provides the global PCB industry with an easy-to-use test system for high-speed digital and RF boards, as well as class-leading tools for fast and accurate design and testing of controlled impedance in PCBs. Polar also leads the industry in tools for automated PCB layer stackup design and documentation. Polar Instruments was established in 1976 and has offices and branded operations in the US, UK, Europe and Asia Pacific. www.polarinstruments.com
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
SMTA Announces 2026 STAR Forum Technical Program
04/16/2026 | SMTAThe SMTA announced the finalized program for the High Reliability: Strategic Technology Advancement Research Forum which takes place on May 6-7, 2026 in Olathe, Kansas, USA.
Breaking the Manual Quoting Bottleneck in Wire Harness
04/15/2026 | Nolan Johnson, SMT007 MagazineArik Vrobel has spent more than 35 years in wire harness manufacturing—starting in EL-Com, his father's shop, building it into a nationally recognized contract manufacturer, and ultimately selling to Aptiv/Winchester in 2021. But retirement didn't last long. Within months, Arik was back, not as a manufacturer this time, but as a technologist. His new company, Cableteque, is building the quoting and data automation platform he always wished existed.
Podcast Hits the Mark in a Materials Market
04/15/2026 | Marcy LaRont, I-Connect007The base material of a printed circuit board is its literal and functional foundation. Isola, founded in 1912 in Düren, Germany, is one of the longest-standing manufacturers of glass-reinforced laminates in the electronics industry. Originally focused on insulation and fiberglass materials, the company played an early role in supplying the foundational substrates that enabled the growth of PCB technology. As electronics advanced, Isola evolved alongside the industry, expanding from basic glass-epoxy laminates into high-performance copper-clad materials and engineered prepregs.
New EIPC President: Building Strength Through Unity in Europe’s Electronics Industry
04/14/2026 | Marcy LaRont, I-Connect007Industry veteran Rico Schluter, newly appointed president of EIPC, discusses his decades-long journey through the European PCB industry and his vision for its future. From building advanced manufacturing operations to leading large-scale facility development in Lithuania, Rico shares insights into automation, workforce evolution, and the challenges of scaling production. He emphasizes the urgent need for stronger collaboration across European industry organizations to effectively influence policy in Brussels, particularly around supply chain resilience, trade regulations, and energy-related incentives.
2026 IPC Masters Competition China Wraps Up With Record Participation
04/07/2026 | Blair Yan, Global Electronics Association East AsiaThe three-day 2026 IPC Masters Competition concluded March 27 at productronica China in Shanghai, bringing together the largest and most highly skilled group of electronics assembly professionals in the event’s 16-year history. With 623 participants from 77 companies across China—up 30% from last year—the competition reflected a growing focus on the practical application of electronics manufacturing standards.