-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
PCB Maker Unitech Looks to Automotive Electronics, IoT for 2016 Growth
December 1, 2015 | DigitimesEstimated reading time: Less than a minute
Taiwan-based PCB maker Unitech Printed Circuit Board expects demand for any-layer designs for use in automotive electronics, wearables and other IoT-connected devices to increase and drive the company's revenue growth in 2016, according to a report by Digitimes.
The report quoted Unitech president Hsu Cheng-hung as saying that any-layer PCB demand for auto and IoT applications will rise and help offset decelerating demand for smartphones.
To cope with the increased demand, Unitech will expand its production capacity for any-layer PCBs by 10% at its manufacturing site in Yilan, northeastern Taiwan, the report said.
Suggested Items
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Happy’s Tech Talk #27: Integrated Mesh Power System (IMPS) for PCBs
04/08/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12, and more to only two layers. Besides reducing direct processing steps, the yield will increase as defect-producing operations are eliminated. The integrated mesh power system (IMPS) was invented in the latter years of MCM-D use for thin-film fabrication. Those geometries fit today into our use of ultra HDI.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
Now Available: Episode 4, Season 2 of Designing for Reality—Lamination
04/04/2024 | I-Connect007I-Connect007 has just released the latest episode of its podcast series, On the Line With..., which focuses on designing for reality in the electronics industry. Multilayer boards bring along a completely different set of processes. In this installment, ASC Sunstone VP/Manager Matt Stevenson discusses manufacturing techniques for multilayer boards. Of course, this necessitates a review of drill and registration techniques, followed by the ins and outs of lamination.