-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Brooks' Bits: Your Traces Have Hot Spots!
August 24, 2016 | Douglas G. Brooks, PhDEstimated reading time: 1 minute
Your traces have hot spots. At least, those that carry a moderate current do. Surprised? Well, I was a little surprised, too, when I looked at this a little more closely.
One chapter in my recent book focuses on fusing current. It contains the image (Figure 1), captured on video, which shows a 20 mil wide trace that had been heated for about 15 minutes, just at the moment of fusing. There are several interesting things in this image, especially how the smoke is blown out from under the trace at certain points with considerable pressure. But note that the trace fuses at a point, not everywhere along the trace. It is clear from observation that the trace is much hotter at some points than at others.
Figure 2 appeared in a separate article published in 2010. (It has been enhanced after some collaboration with the author of that article.) The image shows a trace being heated to the melting point. At this stage, the hottest portions of the trace are over 600°C, but other areas remain in the 200°C temperature range.
The reasons for the temperature variation at high temperatures are not too hard to understand. There may be minor contamination under the trace or in the copper that accounts for it. Certainly, at higher temperatures (say above about 300°C) the board may begin to delaminate, severely disrupting its cooling characteristics. There may be small variations in trace width or thickness that help account for the delam, and these effects would be randomly distributed along the length of the trace.
But in a variety of lower-temperature studies, I personally took trace temperature measurements using a small thermocouple. I noticed that if I moved the thermocouple slightly, I would get a different temperature reading. Not by much, maybe 1.0° or 1.5°C. This is more than the resolution of the thermocouple, but not enough for me to be satisfied that the differences were real. So I began to wonder if these variations in temperature appeared at lower trace temperatures, say in the 40°C. range.
To read this entire article, which appeared in the August 2016 issue of The PCB Design Magazine, click here.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Nortech Systems Launches Power over Fiber Technology Platform for EMI-Sensitive Applications
04/08/2026 | Globe NewswireNortech Systems Incorporated, a leading provider of design and manufacturing solutions for complex electromedical devices and electromechanical systems, has announced the launch of its Power over Fiber technology platform.
Flexible Thinking: Designing Flex Circuits for Dynamic Reliability
04/09/2026 | Joe Fjelstad -- Column: Flexible ThinkingFlex circuits flex. No surprises there. However, they are also very commonly designed into products because they are thin and offer consistent thickness and dielectric properties, attributes highly prized by present-day product designers of personal electronics. This would include smartphones and, increasingly, wearable electronics for medical monitoring and even fashion.
Understanding Tolerances in Flexible Circuit Design
04/01/2026 | Chris Clark, Flexible Circuit TechnologiesThe challenge with cumulative tolerances is meeting the dimensional requirements for items dimensioned on a drawing or specification for a flexible or rigid-flex circuit. It is critical to understand the fabrication processes and how features are defined when creating your tolerance requirements.
Target Condition: An Exploration of Flooding PCB Layers
04/02/2026 | Kelly Dack -- Column: Target ConditionThe concept of flooding PCB layers with copper has been around for so long, you’d think we’d have it mastered. We haven’t. (Oh, and by “we,” I mean design engineers and the software tools we depend on.) Years ago, PCB artwork was created by hand using light tables, with tape applied to Mylar. Signals were slow, traces were relatively wide, and high-current paths were simply “beefed up” with wider copper. Signal integrity wasn’t yet a driving concern. Today, solid return paths are fundamental to robust design. We understand the importance of continuous reference planes for signal integrity and EMI control.
New, Greener Solutions for Etch: Novel Copper Extraction
03/30/2026 | Richard Nichols, GreenSource Engineering“Novel” is a typical marketing phrase that implies new and unique, but often “novel” actually means an established technology being applied to a new field or application. This, in turn, is often driven by newly relevant external motivation. GreenSource has been working on just such a solution: novel copper extraction, offering a better and greener alternative to traditional LLE control systems for cupric chloride etch.