-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
SiSoft to Present, Exhibit at DesignCon 2017
January 18, 2017 | SiSoftEstimated reading time: Less than a minute
SiSoft will be exhibiting and presenting papers at DesignCon 2017. Visit the SiSoft booth #935 next Wednesday and Thursday, February 1-2, 11:00am - 6:00pm.
Pragmatic Signal Integrity Boot Camp
January 31, 9am - 4:30pm
"AMI Model Development from SerDes Design - a Practical Approach"
Tutorial presented with MathWorks
January 31, 1:30pm - 4:30pm
"Getting the Most from IBIS-AMI: Tips and Secrets from the Experts"
Technical panel
January 31, 4:45pm - 6:00pm
"A Beginner's Guide to SerDes and AMI Modeling"
A 40-minute sponsored session presented with MathWorks
February 1, 10:15 - 10:55am
"Application of Pulse Response Extraction to Nonlinear Data Channels"
Technical paper
February 2, 2:00pm - 2:45pm
Engineer of the Year Panel Discussion
45-minute panel discussion
February 2, 3:00 - 3:45pm
IBIS Open Forum Summit
"Things You Can Learn from a Pulse Response"
February 3, 10:15am
For more information, visit www.sisoft.com or www.designcon.com.
Suggested Items
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... DFM Essentials, Chapter 2
11/14/2024 | I-Connect007 Editorial TeamThe guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter discusses panelization, placing PCBs on manufacturing panels, highlighting features like coupons, borders, and scoring to maximize material utilization and reduce costs, and detailing preferred panel sizes and modifications.
Smartphone Panel Shipments to Dip by 1.7% in 2025, with Chinese Manufacturers’ Share Expected to Exceed 70%
11/13/2024 | TrendForceTrendForce’s latest investigations reveal that while the overall smartphone market is projected to grow by just 3% in 2024, increased demand for refurbishes and second-hand devices is fueling growth in the smartphone panel market. Shipments this year are estimated to grow 6.7% YoY to reach 2.066 billion units.
Automating Test Processes in Modern PCBA Manufacturing
11/12/2024 | Josh Casper, Horizon SalesICT and functional test play critical roles in the electronics manufacturing process. In many cases, these processes are the final line of defense in identifying defects, preventing failures from reaching the end user, and safeguarding a manufacturer's reputation. A growing problem in this area has been the sheer increase in production output from the SMT line. As components get smaller, PCBs will continue shrinking, allowing engineers to design highly panelized products.
TTM’s Grand Opening in Malaysia
11/07/2024 | Marcy LaRont, I-Connect007When I last spoke with Tom Edman, president and CEO of TTM Technologies (TTM), he provided an update about the company’s new high-tech printed circuit board facility under construction in Syracuse, New York, and how the grand opening of a facility in Malaysia is informing TTM’s overall expansion efforts: a cutting-edge facility spread across 27 acres and providing roughly 1,000 jobs. Now, Tom provides more details about the new automated facility, its regional and global impact, and the importance of having both government and industry support.
Altus Sees Growing Interest for Laser Depanelling Solutions
11/04/2024 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has seen an increasing interest in laser depaneling systems from LPKF in 2024.