Benmayor Group to Exhibit PCB Automation and Thermal Management Solutions at APEX EXPO 2026

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Benmayor Group will present PCB automation systems and thermal management materials at APEX EXPO 2026, March 17–19 at the Anaheim Convention Center in Anaheim, California. Visitors can meet the company in Exhibit Hall C–D, Booth 4816, where Benmayor brands Technosystem and Aismalibar will demonstrate solutions designed to improve PCB manufacturing efficiency, automation integration, and thermal management performance.

PCB Automation Systems

Technosystem, a Benmayor Group company focused on automation for PCB manufacturing, will exhibit several automation platforms developed for mid- to high-volume production environments.

The Millennium ECO automation platform is engineered to reduce manual handling and prevent panel damage in PCB production environments. The system utilizes a six-axis robotic arm with automatic suction-cup adjustment, enabling non-contact panel handling while automatically adapting to varying panel sizes in real time. The compact design allows integration into existing production lines without significant floor-space requirements.

Technosystem will also present the V3-AOI SINGLE, an automation solution designed to interface with AOI systems from any manufacturer. The system uses two six-axis robotic arms and operates with cycle times under 10 seconds (excluding panel exchange). Integrated CCD camera recognition enables real-time panel alignment on the AOI inspection table.

The ERIZO 60 Loader & Unloader is designed for integration at either the entry or exit of horizontal processing lines. The system is available with 60 panel capacity and can be configured with one or two conveyors. ERIZO systems are designed for automated handling of inner- and outer-layer panels across wet-process production lines.

Thermal Management Materials

Aismalibar, also part of the Benmayor Group, will showcase advanced thermal management materials for high-power PCB applications.

Featured products include BOND SHEET CURED 3.2 W/mK, a thermal interface material designed to eliminate air gaps and reduce thermal resistance between power components and heat sinks while maintaining electrical isolation.

GLASS FREE Bond Sheet materials ranging from 2.0 to 8.0 W/mK, developed for advanced PCB thermal management applications.

IMS ULTRATHIN substrates, engineered to deliver extremely low thermal resistance while maintaining high dielectric strength for high-power electronics with dielectric thickness as low as 35um.

Engineers and manufacturing professionals attending APEX EXPO are invited to visit Booth 4816 to review Benmayor Group’s automation and thermal management technologies for PCB manufacturing.