Global Citizenship: What I’ve Learned About the American PCB Business
Global Sourcing Spotlight: The Best Products to Buy Offshore Through Global Sourcing
Nolan's Notes: The Rise (and Risk) of Data
I-Connect007 Launches New Micro eBook in Design Series for Flex and Rigid-Flex
March 6, 2017 | I-Connect007Estimated reading time: 2 minutes
I-Connect007 is excited to announce the release of a new book in our micro eBook series: The Printed Circuit Designer’s Guide to…Flex and Rigid-Flex Fundamentals.
The Printed Circuit Designer’s Guide to… is an ongoing series of micro eBooks specifically dedicated to the education of PCB designers. This book series will become the gold standard for people seeking the most relevant information available.
The latest title in this new line of eBooks, The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals, is authored by Anaya Vardya and David Lackey of American Standard Circuits. This micro eBook provides both new and seasoned circuit designers with valuable, important information that will help to assure first-pass success in getting their products to market.
“We have found that when we are working with companies who need flex and rigid-flex PCBs, the best course of action is to work closely in partnership with them to make sure we give them the very best value in flex and rigid-flex PCBs,” said Lackey. “We want to make sure our customers get exactly what they need for their end-products.”
Added Vardya, “This guidebook is based on the many conversations we have had with our customer partners helping them to gain a better and more complete understand of this technology. We also consider this our gift; American Standard Circuits’ gift to the industry. This unique guidebook will be available to everyone through a free download on our eBook website.”
This eBook has something for everyone: in addition to guidance on key callouts, design considerations and material sets for optimum manufacturability, there are plenty of do’s and don’ts for fabricators, cost drivers for OEMs and key information on data package requirements for contract manufacturers.
The Printed Circuit Designer's Guide to… Flex and Rigid Flex-Fundamentals is a must-read for anyone in the supply chain using flex or rigid-flex technology.
We welcome you to download this book for free by visiting clicking here. You can also request to be notified when other specific topics become available for download.
Look for these other great titles in our new micro eBook series to be released soon!
- The Printed Circuit Buyer’s Guide to… AS9100 by Imagineering, Inc. (available now!)
- The Printed Circuit Designer’s Guide to… Design for Manufacturability (DFM) by Altium (available now!)
- The Printed Circuit Designer’s Guide to… Secrets of High-Speed PCBs by Polar Instruments
- The EMS Buyer’s Guide to… Procuring High-Complexity Electronics by Zentech
- The Printed Circuit Buyer’s Guide to… Simulation and Analysis by Mentor Graphics
We hope you enjoy The Printed Circuit Designer’s Guide to… Flex and Rigid-Flex Fundamentals.
For more information, contact:
Emmy Ross
I-Connect007 eBooks
+1.651.492.4427 (GMT-6)
Share on:
Suggested Items
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
09/15/2023 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023.
UK Space Agency Launches Consultation on Variable Liability Limits for Orbital Operations
09/15/2023 | UK Space AgencyThe proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
09/14/2023 | MediaTekMediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech Unveils New BRIDGE Solutions to Increase Access to Global Hybrid Connectivity
09/12/2023 | Business WireComtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.