-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
April Issue of The PCB Design Magazine Available Now
April 14, 2017 | Andy Shaughnessy, PCB Design007Estimated reading time: 1 minute
The April 2017 issue of The PCB Design Magazine is available now. This month, our expert contributors discuss the current state of high-speed materials, and the growth of low-loss laminates that pick up where FR-4 falls short.
Choosing the right material for your PCB was so simple a few decades ago. But today, designers often must select an advanced low-loss PCB material with low Df and Dk values—hopefully one that isn’t prohibitively expensive or terribly difficult for fabricators to register during lamination.
So, this month, we feature interviews with a variety of experts on advanced materials. Summit Interconnect’s Gerry Partida and All Flex Flexible Circuits’ Joe Menning spoke with our editorial team about the state of advanced materials from the fabricators’ viewpoint. Craig Davidson of TTM explains the company’s pursuit of embedded optical interconnect and the challenges surrounding optical PCBs. Bruce Mahler of Ohmega Technologies examines Ohmega’s resistive material technology and some of the drivers and issues in that segment of the industry. And APCT’s Steve Robinson discusses his company’s focus on working with PCB designers and engineers to create advanced, high-speed PCBs. Plus, columnist John Coonrod of Rogers Corporation discusses some of the challenges and remedies for woven glass weave effect.
We also have columns by our contributors Barry Olney of In-Circuit Design, and Alistair Little of Electrolube, as well as an interview with Lawrence Romine of Altium and an article about the TIE PCB design conference in Romania, coming up April 25-27.
Read the April issue of The PCB Design Magazine, now on the virtual newsstand and available for delivery in your e-mail inbox by subscribing here or by registering for myIConnect007 where you can manage all your subscriptions and gain instant access to our eBook library.
Suggested Items
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.
Siemens Delivers New Solido IP Validation Suite
05/07/2024 | SiemensSiemens Digital Industries Software introduced Solido™ IP Validation Suite software, a comprehensive, automated signoff solution for quality assurance across all design intellectual property (IP) types, including standard cells, memories and IP blocks.
Altair Acquires Research in Flight, Forging a New Path for Aerodynamic Analysis
05/07/2024 | AltairAltair a global leader in computational intelligence, announced it has acquired Research in Flight, maker of FlightStream®, which provides computational fluid dynamics (CFD) software with a large footprint in the aerospace and defense sector and a growing presence in marine, energy, turbomachinery, and automotive applications.
Happy’s Tech Talk #28: The Power Mesh Architecture for PCBs
05/07/2024 | Happy Holden -- Column: Happy’s Tech TalkA significant decrease in HDI substrate production cost can be achieved by reducing the number of substrate layers from conventional through-hole multilayers and microvia multilayers of eight, 10, 12 (and more), down to four. Besides reducing direct processing steps, yield will increase as defect producing operations are eliminated.