Beyond Design: High-speed Rules of Thumb
Global PCB Connections: A Technical Overview of Long-flex Printed Circuit Boards
The Shaughnessy Report: A Handy Look at Rules of Thumb
Ventec’s Martin Cotton to Speak at Advancements in Thermal Management Conference 2017
August 2, 2017 | VentecEstimated reading time: 1 minute
Ventec International Group, a world leader in the production of polyimide and high-reliability epoxy laminates and prepregs, will present a paper on Advanced IMS Material Solutions at the Advancements in Thermal Management Conference from 9-10 August 2017 in Denver, Colorado, USA.
Martin Cotton, Ventec’s Director of OEM Technology will be presenting his technical paper entitled ‘Advanced Thermal Material Solutions’ on Wednesday, 9 August at 11am at the DoubleTree by Hilton Denver Tech Center.
Thermal issues in printed circuit boards and their related assemblies are becoming as important as the signal integrity in the design and manufacture of PCBs. The relationship between the materials used and the thermal functionality is a key focus as industry sectors tackle issues of reliability, aging and functionality. Costs and the value analysis between thermal transfer rates and materials used are fast becoming a design discipline that has huge effects on final assembly cost and thermal functionality.
Martin’s presentation introduces new generation materials, their background and what current solutions are being used by various market sectors. Discussion on the next generation of insulated metal substrates (IMS) and prepregs for printed circuit boards and hybrid constructions will be covered. Design and the value analysis required to lower cost in the final assembly while maintaining thermal function will be reviewed. Finally, the myths and misunderstandings around thermal materials and how to use them will be explained.
Martin will be joined by Jack Pattie, President of Ventec USA.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the U.S. and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.
Share on:
Suggested Items
Unlocking Advanced Circuitry Through Liquid Metal Ink
10/31/2024 | I-Connect007 Editorial TeamPCB UHDI technologist John Johnson of American Standard Circuits discusses the evolving landscape of electronics manufacturing and the critical role of innovation, specifically liquid metal ink technology, as an alternate process to traditional metallization in PCB fabrication to achieve ever finer features and tighter tolerances. The discussion highlights the benefits of reliability, efficiency, and yields as a tradeoff to any increased cost to run the process. As this technology becomes better understood and accepted, even sought out by customers and designers, John says there is a move toward mainstream incorporation.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Book Excerpt: The Printed Circuit Designer’s Guide to... DFM Essentials, Ch. 1
10/25/2024 | I-Connect007The guidelines offered in this book are based on both ASC recommendations and IPC standards with the understanding that some may require adjustment based on the material set, fabricator processes, and other design constraints. This chapter details high-frequency materials, copper foil types, metal core PCBs, and the benefits of embedded capacitance and resistor materials in multilayer PCBs.
The Cost-Benefit Analysis of Direct Metallization
10/21/2024 | Carmichael Gugliotti, MacDermid AlphaCarmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.
Connect the Dots: Designing for Reality—Pattern Plating
10/16/2024 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we painted the picture of the outer layer imaging process. Now we are ready for pattern plating, where fabrication can get tricky. The board is now ready to receive the copper traces, pads, and other elements specified in the original CAD design. This article will lay out the pattern plating process and discuss constraints in the chemistries that must be properly managed to meet the customer's exacting manufacturing tolerances.