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Ventec’s Martin Cotton to Speak at Advancements in Thermal Management Conference 2017August 2, 2017 | Ventec
Estimated reading time: 1 minute
Ventec International Group, a world leader in the production of polyimide and high-reliability epoxy laminates and prepregs, will present a paper on Advanced IMS Material Solutions at the Advancements in Thermal Management Conference from 9-10 August 2017 in Denver, Colorado, USA.
Martin Cotton, Ventec’s Director of OEM Technology will be presenting his technical paper entitled ‘Advanced Thermal Material Solutions’ on Wednesday, 9 August at 11am at the DoubleTree by Hilton Denver Tech Center.
Thermal issues in printed circuit boards and their related assemblies are becoming as important as the signal integrity in the design and manufacture of PCBs. The relationship between the materials used and the thermal functionality is a key focus as industry sectors tackle issues of reliability, aging and functionality. Costs and the value analysis between thermal transfer rates and materials used are fast becoming a design discipline that has huge effects on final assembly cost and thermal functionality.
Martin’s presentation introduces new generation materials, their background and what current solutions are being used by various market sectors. Discussion on the next generation of insulated metal substrates (IMS) and prepregs for printed circuit boards and hybrid constructions will be covered. Design and the value analysis required to lower cost in the final assembly while maintaining thermal function will be reviewed. Finally, the myths and misunderstandings around thermal materials and how to use them will be explained.
Martin will be joined by Jack Pattie, President of Ventec USA.
About Ventec International
With volume manufacturing facilities and HQ in Suzhou China, Ventec International specializes in advanced copper clad glass reinforced and metal backed substrates for the PCB industry. With distribution locations and manufacturing sites in both the U.S. and Europe, Ventec International is a premier supplier to the global PCB industry. For more information, click here.
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.