Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Zuken USA Now Accepting Abstracts for ZIW 2018
August 18, 2017 | ZukenEstimated reading time: 1 minute
Zuken USA is now accepting abstracts for Zuken Innovation World (ZIW) 2018, to be held on April 23-25 in San Diego, California. The event includes a two-day technical conference and one-day exhibition to be held at the Coronado Island Marriott Resort & Spa.
ZIW annually offers more than 40 technical sessions including Zuken University classes showcasing how-to and best practices for the current and upcoming 2018 product releases. Zuken’s Expert Bar and the Technology Showcase provide one-on-one access to Zuken’s technical team and partner solutions.
Abstracts are now being accepted for 45-minute educational presentations. Suggested presentation topics include design disciplines such as PCB, IC packaging, wire harness, control panel and design data management. Industry trends, process innovation and new design methodologies are also topics of interest.
Presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.
Abstracts of 100-300 words and speaker biographies should be submitted to Zuken by November 3, 2017. For additional details and deadline information, visit the ZIW Speakers Corner.
About ZIW
Zuken Innovation World conferences take place annually at venues around the globe. The conferences bring together the best technical and business minds in the Zuken community for dynamic interaction that interests, educates and inspires our attendees. The ZIW Americas agenda will feature a mix of user presentations, Zuken University classes, discussion groups and lively networking events.
Share on:
Suggested Items
SP Manufacturing Expands with New Malaysia Plant, Acquires Ideal Jacobs
12/26/2024 | PRNewswireSP Manufacturing (SPM), a leader in Electronic Manufacturing Services (EMS), is strengthening its global presence with two major moves: opening a new manufacturing facility in Senai, Malaysia, and successfully acquiring Ideal Jacobs Corporation.
Robosys, ACUA Ocean + OREC Secure Funding For Collaborative Autonomy Project
12/25/2024 | RobosysAdvanced maritime autonomy developer, Robosys Automation, supported by USV manufacturer, ACUA Ocean, and Offshore Renewable Energy Catapult (OREC), have jointly secured grant funding through Innovate UK.
IPC Announces New Training Course: PCB Design for Military & Aerospace Applications
12/23/2024 | IPCIPC announced the launch of a new training course: PCB Design for Military & Aerospace Applications.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.