Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
Target Condition: When Design Outpaces Manufacturing
Zuken USA Now Accepting Abstracts for ZIW 2018
August 18, 2017 | ZukenEstimated reading time: 1 minute
Zuken USA is now accepting abstracts for Zuken Innovation World (ZIW) 2018, to be held on April 23-25 in San Diego, California. The event includes a two-day technical conference and one-day exhibition to be held at the Coronado Island Marriott Resort & Spa.
ZIW annually offers more than 40 technical sessions including Zuken University classes showcasing how-to and best practices for the current and upcoming 2018 product releases. Zuken’s Expert Bar and the Technology Showcase provide one-on-one access to Zuken’s technical team and partner solutions.
Abstracts are now being accepted for 45-minute educational presentations. Suggested presentation topics include design disciplines such as PCB, IC packaging, wire harness, control panel and design data management. Industry trends, process innovation and new design methodologies are also topics of interest.
Presentations must be noncommercial in nature and should focus on technology, techniques or methodology. Case studies, how-to information and usage tips are favored and individual or team presentations are welcome.
Abstracts of 100-300 words and speaker biographies should be submitted to Zuken by November 3, 2017. For additional details and deadline information, visit the ZIW Speakers Corner.
About ZIW
Zuken Innovation World conferences take place annually at venues around the globe. The conferences bring together the best technical and business minds in the Zuken community for dynamic interaction that interests, educates and inspires our attendees. The ZIW Americas agenda will feature a mix of user presentations, Zuken University classes, discussion groups and lively networking events.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
ASC Sunstone Circuits to Exhibit at PCB East 2026
04/26/2026 | ASC Sunstone CircuitsAnaya Vardya, President and CEO of ASC Sunstone Circuits, a leading provider of printed circuit board (PCB) fabrication and assembly solutions, announced that the company will be exhibiting at PCB East 2026, taking place April 29 at the DCU Convention Center.
PCB Technologies to Exhibit at PCB East 2026
04/23/2026 | PCB Technologies Ltd.Issey Ende, PCB-Technolgies’ VP of Sales and Marketinghas announced that his company will be exhibiting at this year’s PCB East 2026, the premier East Coast conference and exhibition for the electronics design, fabrication, and assembly industry on Wednesday, April 29, 2026, at the DCU Convention Center in Worcester, Massachusetts.
Design for Test: A New Book from The Test Connection, Inc.
04/23/2026 | Real Time with... APEX EXPOBert Horner, president of The Test Connection Inc., shares insights on designing for testability (DFT) challenges with Kelly Dack. Horner discusses the critical need for incorporating testability early in the design process and the importance of quantifiable metrics for measuring test coverage. He highlights The Test Connection's role in transferring decades of 'tribal knowledge' to emerging engineers through training and education. Look for "The Printed Circuit Assembler's Guide to... Design for Test, A Practical Guide to Test and Inspection" in the I-007eBooks library.
Changing Times: Siemens Plans to Sell Former Mentor Graphics Wilsonville Campus
04/22/2026 | Nolan Johnson, I-Connect007Siemens announced it will be selling its Wilsonville, Oregon, property, which has served as the campus for Mentor Graphics, which was later acquired by German EDA-giant Siemens, as reported by The Oregonian on April 20. Siemens will maintain one building on the sprawling 53-acre campus, citing the move to hybrid and remote work over the past few years as a key factor in the decision.
Siemens Collaborates with TSMC to Advance AI for Semiconductor Design
04/22/2026 | SiemensSiemens announced the continuation of collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.