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New Cadence Allegro DesignTrue DFM Technology Accelerates New Product Development and Introduction ProcessSeptember 13, 2017 | Cadence Design Systems, Inc.
Estimated reading time: 3 minutes
Cadence Design Systems, Inc. today announced Cadence Allegro DesignTrue DFM technology, the industry’s first solution to perform real-time, in-design design-for-manufacturing (DFM) checks integrated with electrical, physical and spacing design rule checks (DRCs). The innovative new technology, integrated into the Allegro PCB Editor, enables PCB designers to identify and correct errors immediately, long before manufacturing signoff. By finding errors earlier, design teams reduce rework, shorten design cycles and accelerate the new product development and introduction process, potentially saving at least one day per iteration and days to weeks overall.
Unlike manufacturing signoff tools that are run in batch mode when performing DFM checks, Allegro DesignTrue DFM technology provides continuous in-design feedback while designing, eliminating the frustrating and time-consuming design-verify-fix iterations between PCB designers and DFM checking teams. By the time PCB designers reach final DFM signoff, they already know their design meets manufacturing rules, resulting in a smoother signoff and handoff to the manufacturing partner and a shorter, more predictable design cycle.
Allegro DesignTrue DFM technology is consistent with the proven Allegro constraint-driven design flow and online checking solution currently used for electrical, physical and spacing rules. Allegro DesignTrue technology provides a wide set of checks to ensure design manufacturability. Spacing between copper features such as traces, pins, vias relative to the board outline and other copper features can be verified in real time, independent of electrical and net-based rules.
The new technology makes it easy to configure, apply contextually and reuse manufacturing rules. Allegro DesignTrue DFM technology supports the import and export of DFM rules and addresses more than 2,000 advanced checks. In addition, it employs a new and more user-friendly DRC browser capable of addressing one class of errors at a time. Constraints are highly configurable with the ability to enable and disable groups and whole categories of rules, or individual rules. Rules can be applied in etch mode, non-etch mode, and in stack-up mode, giving designers the ability to isolate layers, geometries and cutouts. The new browser also features an integrated DRC description with graphics, characterizes DRCs by type and provides a DRC count chart. Users can quickly sort, browse and review, as well as waive and unwaive DRCs.
“Increasing PCB complexity is extending our design cycles and making them unpredictable,” said Greg Bodi, director of System Engineering PCB Layout at NVIDIA. “With Allegro DesignTrue DFM technology, our PCB design teams can be sure that they are designing the board correctly the first time, taking into account electrical, physical and manufacturing constraints. This eliminates unnecessary iterations with manufacturing signoff processes and saves us days to weeks of time.”
“Accelerating new product development and introduction is a key priority for our customers,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group. “For more than 15 years, our customers have relied on the Allegro constraint-driven flow and online checking solution for the electrical and physical domains. As part of our System Design Enablement strategy, we’re now applying this same approach to DFM checks. Extending our solution to the manufacturing domain enables electronics OEMs to bring their products to market more quickly and with greater confidence.”
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. For more information, click here.
After working for a capital equipment supplier for almost 50 years, I’ve found that the most important part of getting to know your vendor is good communication among all parties. While contact between fabricators of a constantly changing product line and the designers of those products may occur daily or weekly, conversations between you and your equipment supplier may be years apart. That lengthy gap often means that previous contacts may have been promoted, retired, or moved on to other opportunities. You may have also migrated to a new supplier with whom you have little or no history. In either case, you will be interacting with someone you are unfamiliar with (as they are with you). Therefore, it is essential for both sides to communicate clearly so expectations will align.
The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.
The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.
Electrodeposition comes down to fundamentals. In the early days of plating, many users considered the nuances of metallization as black magic. Those days are long gone. Having a thorough understanding of the critical parameters that influence electrodeposition will determine success.
High Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.