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New Cadence Allegro DesignTrue DFM Technology Accelerates New Product Development and Introduction Process
September 13, 2017 | Cadence Design Systems, Inc.Estimated reading time: 3 minutes
Cadence Design Systems, Inc. today announced Cadence Allegro DesignTrue DFM technology, the industry’s first solution to perform real-time, in-design design-for-manufacturing (DFM) checks integrated with electrical, physical and spacing design rule checks (DRCs). The innovative new technology, integrated into the Allegro PCB Editor, enables PCB designers to identify and correct errors immediately, long before manufacturing signoff. By finding errors earlier, design teams reduce rework, shorten design cycles and accelerate the new product development and introduction process, potentially saving at least one day per iteration and days to weeks overall.
Unlike manufacturing signoff tools that are run in batch mode when performing DFM checks, Allegro DesignTrue DFM technology provides continuous in-design feedback while designing, eliminating the frustrating and time-consuming design-verify-fix iterations between PCB designers and DFM checking teams. By the time PCB designers reach final DFM signoff, they already know their design meets manufacturing rules, resulting in a smoother signoff and handoff to the manufacturing partner and a shorter, more predictable design cycle.
Allegro DesignTrue DFM technology is consistent with the proven Allegro constraint-driven design flow and online checking solution currently used for electrical, physical and spacing rules. Allegro DesignTrue technology provides a wide set of checks to ensure design manufacturability. Spacing between copper features such as traces, pins, vias relative to the board outline and other copper features can be verified in real time, independent of electrical and net-based rules.
The new technology makes it easy to configure, apply contextually and reuse manufacturing rules. Allegro DesignTrue DFM technology supports the import and export of DFM rules and addresses more than 2,000 advanced checks. In addition, it employs a new and more user-friendly DRC browser capable of addressing one class of errors at a time. Constraints are highly configurable with the ability to enable and disable groups and whole categories of rules, or individual rules. Rules can be applied in etch mode, non-etch mode, and in stack-up mode, giving designers the ability to isolate layers, geometries and cutouts. The new browser also features an integrated DRC description with graphics, characterizes DRCs by type and provides a DRC count chart. Users can quickly sort, browse and review, as well as waive and unwaive DRCs.
“Increasing PCB complexity is extending our design cycles and making them unpredictable,” said Greg Bodi, director of System Engineering PCB Layout at NVIDIA. “With Allegro DesignTrue DFM technology, our PCB design teams can be sure that they are designing the board correctly the first time, taking into account electrical, physical and manufacturing constraints. This eliminates unnecessary iterations with manufacturing signoff processes and saves us days to weeks of time.”
“Accelerating new product development and introduction is a key priority for our customers,” said Tom Beckley, senior vice president and general manager, Custom IC & PCB Group. “For more than 15 years, our customers have relied on the Allegro constraint-driven flow and online checking solution for the electrical and physical domains. As part of our System Design Enablement strategy, we’re now applying this same approach to DFM checks. Extending our solution to the manufacturing domain enables electronics OEMs to bring their products to market more quickly and with greater confidence.”
About Cadence
Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine’s 100 Best Companies to Work For. For more information, click here.
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Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Volatile Metals Market Creates PCB Pricing Headache
04/20/2026 | Nolan Johnson, I-Connect007Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.