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See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025

05/28/2025 | TopLine
Aerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.

UNIST, SK On Strengthen Collaboration to Cultivate Battery Talent and Enhance R&D Capabilities

05/28/2025 | UNIST
UNIST announced its plans to deepen collaboration with SK On to foster talent in the battery industry. This strategic partnership aims to attract outstanding researchers, broaden the foundation of research and development, and secure future competitive advantages.

Zhen Ding’s Chairman Charles Shen Shares 10 Life Lessons with Graduates

05/27/2025 | Zhen Ding
At the 2025 Commencement Ceremony, Yuan Ze University sincerely invites a renowned yet low-profile figure in the PCB industry, Chairman Charles Shen of Zhen Ding Technology Group, as the keynote speaker.

Incap UK Invests in SMT Technology as Part of Long-Term Operational Development

05/23/2025 | Incap
Incap Electronics UK has completed the second phase of SMT (surface-mount technology) production lines upgrade at its facility in Newcastle-under-Lyme.

Geopolitical Tensions Fuel a Wave of AI Chip Independence as US and Chinese CSPs Race to Develop In-House ASICs

05/15/2025 | TrendForce
TrendForce’s latest research reveals that the surge in demand for AI servers is accelerating the pace at which major US CSPs are developing in-house ASICs, with new iterations being released every one to two years. In China, the AI server market is adjusting to new US export controls introduced in April 2025, which are expected to reduce the share of imported chips (e.g., from NVIDIA and AMD) from 63% in 2024 to around 42% in 2025.
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