-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Now Available: The March 2018 Edition of Design007 Magazine
March 14, 2018 | Andy Shaughnessy, Design007 MagazineEstimated reading time: Less than a minute

The March issue of Design007 Magazine has published and is now available for download.
Today’s EDA tools contain more horsepower than anyone could have imagined not long ago. For our “Tools and Technology” issue of Design007 Magazine, we asked our expert contributors to discuss their newest software tools and technology, and the advantages of having the best tool for the job.
Check it all out this month in Design007 Magazine, now on the virtual newsstand and available for delivery in your e-mailbox each month by subscribing here.
You can also download the pdf version for future reference.
Suggested Items
Nokia, Honeywell Aerospace Technologies Partner with Numana to Advance Quantum-safe Networks
04/01/2025 | HoneywellNokia and Honeywell Aerospace Technologies announced a strategic partnership with Numana to advance Quantum-Safe Networks (QSN) in Montreal, Canada, and worldwide.
European Chips Skills Academy Launches ECS Summer School 2025 to Inspire Future Electronics Talent
04/01/2025 | JCN NewswireThe European Chips Skills Academy (ECSA), an EU-funded project coordinated by SEMI Europe, in collaboration with industry partners AENEAS, EPoSS, and INSIDE, has announced the launch of the ECS Summer School 2025.
Real Time with... IPC APEX EXPO 2025: Highlighting Global PCB Trends and Technologies with all4-PCB
04/01/2025 | Real Time with...IPC APEX EXPOAndy Shaughnessy and all4-PCB's Ralph Jacobo discuss global distribution trends in the PCB industry, focusing on new technologies in plasma etching and final inspection. Ralph highlights the importance of IC substrate buildup technology and partnerships in the market.
Incap Launches ‘Incap Legends’ esports Tournament and Invites Students from Around the World to Participate
03/31/2025 | IncapIncap Corporation is proud to announce the launch of ‘Incap Legends’, a new esports tournament in partnership with Newcastle and Stafford Colleges Group (NSCG).
Foxconn Chairman Young Liu to Deliver Keynote at COMPUTEX 2025
03/28/2025 | PRNewswireTAITRA (Taiwan External Trade Development Council), announced that Young Liu, Chairman of Hon Hai Technology Group (Foxconn), is invited to be the speaker at COMPUTEX 2025 Keynote, sharing his vision on three intelligent platforms driving industry transformation and the role of robotics in factories of the future.