-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInner Layer Precision & Yields
In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
Engineering Economics
The real cost to manufacture a PCB encompasses everything that goes into making the product: the materials and other value-added supplies, machine and personnel costs, and most importantly, your quality. A hard look at real costs seems wholly appropriate.
Alternate Metallization Processes
Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Estimated reading time: 1 minute
Developments in Wet Processing: Beyond Spraying and Dipping
Spraying and dipping! Wet processing is based on two simple principles: Spray the work piece or immerse it in a bath. Most of the things you do in a complex machine you could also do with a series of buckets, but the results are likely to be much less reliable or efficient.
My work in the printed circuit industry has involved roles in many factories and using a wide variety of equipment, both new and old. At times, the major battle was just to keep the conveyors turning for another day. Enhancing the process effect was often a matter of slowing down the process to give a little more time for things to happen. Right now, I am involved with the supply of a variety of equipment, some of which I would regard as pretty standard and others that involve new ideas that have the potential to solve particular problems.
The target for equipment sellers is to be able to offer a machine that has advantages over the competition. This drives development, but it is still sometimes difficult to let the end users know what is new on the market. Some of the following examples may be reasonably well known and understood but they show how the equipment can be tailored towards a purpose even though the working basis of the machine is standard.
Earlier this year I was involved in installing an immersion tin line for a customer. The process and the chemistry are not new or special in any way. However, the machine was built to overcome a problem with the immersion tin chemistry, which makes the process more labour intensive to maintain. Immersion tin chemistry does not like to be agitated very much. Bubbles in the solution cause solids to form, which degrades the solution and causes problems with the hardware. The solids settle to the bottom and can damage pumps and heaters, or at the very least make them less effective. The machine I was working on was a horizontal process, which means the immersion tin chemistry is applied in a flood rinse. This effectively means that the conveyor is flooded with chemistry, so the panel is in a complete bath while it is passing through that section of the line.
To read the full version of this article which originally appeared in the June 2018 issue of PCB007 Magazine, click here.
More Columns from Ladle on Manufacturing
Ladle on Manufacturing: LED UV Cure—Does It Really Work?Ladle on Manufacturing: UV Cure LED Energy Saver
Ladle on Manufacturing: Sharing an Idea for Christmas
Ladle on Manufacturing: Behind the Scenes at productronica 2019
Ladle on Manufacturing: Sunday Afternoon in Dongguan
The Travelling Engineer, Installment 2
Ladle on Manufacturing: VCP—The Future of Plating
Ladle on Manufacturing: What’s New?