The Shaughnessy Report: Watt About Power Integrity?
Global PCB Connections: Understanding Your Fabricator’s Capabilities (or Niche)
Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Ventec's Technology Ambassador Alun Morgan to Keynote at AltiumLive 2019
January 14, 2019 | Ventec International GroupEstimated reading time: 1 minute
Ventec International Group Co., Ltd., a world leader in the production of polyimide and high reliability epoxy laminates and prepregs and specialist provider of thermal management and IMS solutions, is pleased to announce Technology Ambassador Alun Morgan as a keynote speaker at the AltiumLive summit in Munich on the 16 January 2019 with a presentation on ‘PCB base material properties and developments: What designers need to know'.
AltiumLive is the annual PCB design summit which has quickly become one of the largest electronics conferences in the world.
Alun's presentation will focus on PCB base material properties and developments, aiming to give designers a greater understanding of the base materials used in their designs and the critical properties of base materials that impact performance.
Alun will review the development of high reliability base materials for PCBs with a focus on thermal performance, reliability and signal integrity. He will explore classification by application as a method of substrate selection which gives the designer the flexibility to select the appropriate substrate for an application without over engineering performance that is neither required nor can be afforded. The presentation includes a straightforward guide to the PCB substrate manufacturing process emphasising the impact of resin chemistry, material reinforcement and copper foil properties on substrate performance. Armed with this knowledge, PCB Designers will be able to better specify and choose appropriate materials for their needs.
Ian Mayoh, European technical support manager, will also be expertly on hand throughout the event and at the Ventec booth for any technical advice required.
About Ventec International Group
Ventec International is a premier supplier to the Global PCB industry. With volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specializes in advanced copper clad glass reinforced and metal backed substrates. Ventec materials, which include high-quality enhanced FR4, high-speed/low-loss- & high-performance IMS material technology and an advanced range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015, and are backed by a fully controlled and managed global supply chain, sales- and technical support-network.
Visit I-007eBooks to download your copy of Ventec micro eBook today:
The Printed Circuit Designer's Guide to...Thermal Management with Insulated Metal Substrates
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.