-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Mentor White Paper: IoT and the New Breed of Designers
January 17, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
A new breed of designers has arrived that is leveraging inexpensive sensors to build the intelligent systems at the edge of the Internet of Things (IoT). These systems play in every space: from devices on the body, vehicles, the workplace, across the land, sea, air, and the outer reaches of space.
It’s no surprise that this new breed of designers is taking full advantage of advanced sensing technology to invent IoT devices for an unlimited market space. Who are the new breed of designers and what tools and processes do they employ to get their jobs done quickly?
This white paper presents an overview of bringing together a design flow for IoT edge device creation that includes IC design, embedded software, system exploration and documentation, and PCB design. Click here to download this white paper
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
PCB Design Software Market to Hit $12.11 Billion by 2033, Growing at a CAGR of 13.77%
11/14/2025 | Globe NewswireThe PCB Design Software Market Size was valued at USD 4.32 Billion in 2025E and is expected to reach USD 12.11 Billion by 2033 and grow at a CAGR of 13.77% over the forecast period 2026-2033.
Zuken Opens Call for Papers for ZIW Americas 2026
11/13/2025 | ZukenZuken USA, Inc. opens the Zuken Innovation World (ZIW) Americas 2026 Call for Papers to help engineers, managers, and leaders showcase proven results and advance industry best practices. ZIW is Zuken USA’s semi-annual Digital Engineering conference on electrical and electronic design for engineers, managers, and industry leaders. It focuses on current practices and emerging trends with practical takeaways.
Innatera Signs Joya as ODM Customer, Bringing Neuromorphic Edge AI into Everyday Connected Products
11/13/2025 | PRNewswireInnatera, the leader in brain-like neuromorphic computing for ultra-low-power intelligence at the sensor edge, today announced that Xiamen Joyatech Co., Ltd. has become its first Original Design Manufacturer (ODM) customer.
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
Electronic Design Automation (EDA) Market Size to Reach $811.1 Million by 2030
11/12/2025 | PRNewswireThe Global Electronic Design Automation (EDA) Market was estimated to be worth USD 541 Million in 2023 and is forecast to a readjusted size of USD 811.1 Million by 2030 with a CAGR of 6.4% during the forecast period 2024-2030.