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Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
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Mentor White Paper: IoT and the New Breed of Designers
January 17, 2019 | Mentor, a Siemens businessEstimated reading time: Less than a minute
A new breed of designers has arrived that is leveraging inexpensive sensors to build the intelligent systems at the edge of the Internet of Things (IoT). These systems play in every space: from devices on the body, vehicles, the workplace, across the land, sea, air, and the outer reaches of space.
It’s no surprise that this new breed of designers is taking full advantage of advanced sensing technology to invent IoT devices for an unlimited market space. Who are the new breed of designers and what tools and processes do they employ to get their jobs done quickly?
This white paper presents an overview of bringing together a design flow for IoT edge device creation that includes IC design, embedded software, system exploration and documentation, and PCB design. Click here to download this white paper
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Professors from Cornell University and University of Michigan to Be Honored for Excellence in Semiconductor Research
11/07/2025 | SIASIA and SRC present the University Research Awards annually to professors who demonstrate excellence in advancing research in semiconductor technology and design.
CELUS, NextPCB Establish Strategic Partnership to Accelerate AI-Driven Electronics Design and Manufacturing
11/07/2025 | BUSINESS WIRECELUS, the developer of a leading AI-assisted electronics design platform, and NextPCB, a globally recognized PCB manufacturing and assembly service provider, announced a strategic partnership aimed at streamlining the electronics development lifecycle from concept to mass production.
Siemens, NVIDIA Preview Industrial Tech Stack for AI-Era Manufacturing
11/07/2025 | SiemensAt the NVIDIA GTC (GPU Technology Conference) in Washington, D.C., Siemens and NVIDIA demonstrated a new technology stack currently in development for the Siemens Xcelerator portfolio.
Everyone’s Talking About Power
11/06/2025 | Heidi Barnes, Keysight TechnologiesDelivering power to a digital load is an AC function, not DC. That simple statement may be obvious, but the implications of how electricity travels to an electronic load are complicated. Dynamic loads with rapidly changing currents create electric and magnetic fields that adhere to Maxwell’s equations. Ground can be misleading and is probably better used for describing where one grows potatoes and carrots. Electrical currents have “return paths,” and the energy is traveling in the fields between the power rail and the return path.
New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.