-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Scientists Develop Low-Cost Energy-Efficient Materials
April 24, 2019 | NUST MISISEstimated reading time: 1 minute

An international team of scientists from the National University of Science and Technology “MISIS” (NUST MISIS), Tianjin University (China), as well as from Japan and the United States has developed new energy-efficient iron-based alloys which combine high mechanical and magnetic properties with low cost and open up new opportunities for industry. The research results are published in the Journal of Alloys and Compounds.
Today, scientists from different countries are facing the task of creating new materials which would help to reduce losses in electricity transmission and transformation. This would lead to energy savings and help to reduce emissions of hazardous gases during production (including CO2 — one of the key factors for the greenhouse effect). Electronic devices could be reduced in size by increasing efficiency.
To solve this problem, the international team of scientists engaged in the development of amorphous softmagnetic alloys in low-cost alloy systems such as Fe-Si-B-Nb-Cu (iron-silicon-boron-niobium-copper).
“For the development of new alloys based on iron with a high complex of magnetic and strength properties, we have analyzed a large number of alloy compositions. At the same time, we tried to avoid the use of expensive alloying elements, such as niobium and molybdenum. All the alloys examined in the work were obtained using industrial technology —quenching from a liquid state (melt spinning technic,),” said Andrei Bazlov, one of the authors of the study, an engineer at NUST MISIS.
According to him, the analysis of a large number of Fe82-85B13-16Si1Cu1 alloys allowed scientists to determine the effect of their chemical composition and heat treatment modes on the magnetic and mechanical properties. As a result, they managed to obtain alloys with high magnetic properties, technological plasticity, and ultrahigh strength.
“In terms of their properties, the new amorphous iron-based alloys obtained by us surpass common industrial analogues not only in Russia but also abroad. Their undoubted advantages are relatively low cost (due to the lack of expensive alloying elements) and simplicity of industrial production,” said Andrei Bazlov.
Scientists will continue to develop new compositions and processing regimes of amorphous magnetically soft alloys. They are also planning to implement their developments in the industry.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Nolan’s Notes: Tariffs, Technologies, and Optimization
10/01/2025 | Nolan Johnson -- Column: Nolan's NotesLast month, SMT007 Magazine spotlighted India, and boy, did we pick a good time to do so. Tariff and trade news involving India was breaking like a storm surge. The U.S. tariffs shifted India from one of the most favorable trade agreements to the least favorable. Electronics continue to be exempt for the time being, but lest you think that we’re free and clear because we manufacture electronics, steel and aluminum are specifically called out at the 50% tariff levels.
MacDermid Alpha & Graphic PLC Lead UK’s First Horizontal Electroless Copper Installation
09/30/2025 | MacDermid Alpha & Graphic PLCMacDermid Alpha Electronics Solutions, a leading supplier of integrated materials and chemistries to the electronics industry, is proud to support Graphic PLC, a Somacis company, with the installation of the first horizontal electroless copper metallization process in the UK.
Electrodeposited Copper Foils Market to Grow by $11.7 Billion Over 2025-2032
09/18/2025 | Globe NewswireThe global electrodeposited copper foils market is poised for dynamic growth, driven by the rising adoption in advanced electronics and renewable energy storage solutions.
MacDermid Alpha Showcases Advanced Interconnect Solutions at PCIM Asia 2025
09/18/2025 | MacDermid Alpha Electronics SolutionsMacDermid Alpha Electronic Solutions, a global leader in materials for power electronics and semiconductor assembly, will showcase its latest interconnect innovations in electronic interconnect materials at PCIM Asia 2025, held from September 24 to 26 at the Shanghai New International Expo Centre, Booth N5-E30