-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Decoupled Graphene Thanks to Potassium Bromide
April 29, 2019 | University of BaselEstimated reading time: 2 minutes
The use of potassium bromide in the production of graphene on a copper surface can lead to better results. When potassium bromide molecules arrange themselves between graphene and copper, it results in electronic decoupling. This alters the electrical properties of the graphene produced, bringing them closer to pure graphene, as reported by physicists from the universities of Basel, Modena and Munich in the journal ACS Nano.
Image Caption: Potassium bromide molecules (pink) arrange themselves between the copper substrate (yellow) and the graphene layer (gray). This brings about electrical decoupling, as demonstrated by scanning probe microscopy studies.
Graphene consists of a layer of carbon atoms just one atom in thickness in a honeycomb pattern and is the subject of intensive worldwide research. Thanks to its high level of flexibility, combined with excellent stability and electrical conductivity, graphene has numerous promising applications—particularly in electronic components.
Molecules for Decoupling
Graphene is often produced via a chemical reaction on metallic surfaces in a process known as chemical vapor deposition. The graphene layer and the underlying metal are then electrically coupled, which diminishes some of the special electrical properties of graphene. For use in electronics, the graphene has to be transferred onto insulating substrates in a multistep process, during which there is a risk of damage and contamination.
In order to obtain defect-free, pure graphene, it is therefore preferable to decouple the graphene electrically from the metallic substrate and to develop a method that allows easier transfer without damage. The group led by Professor Ernst Meyer from the Department of Physics and the Swiss Nanoscience Institute (SNI) of the University of Basel is investigating ways of incorporating molecules between the graphene layer and the substrate after the chemical deposition process, which leads to this type of decoupling.
Altering Electrical Properties
In a study carried out by SNI doctoral student Mathias Schulzendorf, scientists have shown that potassium bromide is ideally suited to this. Potassium bromide is a soluble hydrogen bromide salt. Unlike the chemically similar compound sodium chloride, potassium bromide molecules arrange themselves between the graphene layer and the copper substrate. This was demonstrated by researchers in a variety of scanning probe microscopy studies.
Calculations performed by colleagues at the University of Modena and Reggio Emilia (Italy) explain this phenomenon: It is more energetically advantageous for the system if potassium bromide molecules arrange themselves between the graphene and copper than if they are deposited on the graphene—as happens with sodium chloride.
The researchers have shown that the intermediate layer of potassium bromide alters the electrical properties of graphene—until they correspond to those expected for free graphene. “Our work has demonstrated that the graphene and the underlying metal can be decoupled using potassium bromide, bringing us a key step closer to producing clean and defect-free graphene,” says project supervisor Dr. Thilo Glatzel, who is a member of Meyer’s team.
Suggested Items
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.
OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space
12/12/2024 | BUSINESS WIREThe OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multilayer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB. The stepped copper coin is offered in two types, circular and rectangular, to suit the shape of the electronic component mounted on the PCB. OTC is working to develop mass-production technologies with the aim of introducing PCBs incorporating this new technology into markets for compact devices or devices used in outer space or other environments where air cooling technology cannot be used.
Fresh PCB Concepts: PCB Plating Process Overview
12/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsIn this installment of Fresh PCB Concepts, Mike Marshall takes the helm stating: PCBs have been the platform for the interconnection of electronic components for decades. Because of process costs and other constraints, such as mechanical properties or size limitations of the alternatives, PCBs will remain the standard low-cost interconnection technology. Rapidly increasing performance and functionality requirements of wireless and high-speed devices have challenged the development and implementation of new manufacturing solutions.