-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Just Ask Happy: Routing BGAs With High-Speed Diff Pairs
June 25, 2020 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
We asked for you to send in your questions for Happy Holden, and you took us up on it! The questions you've posed run the gamut, covering technology, the worldwide fab market, and everything in between. Enjoy.
Q: What advice can you give for routing BGAs with high-speed diff pairs when the routing of these signals so often cuts off routing channels for other signals?
A: This can be a complex topic, as there are a lot of circumstances that require consideration. My advice is to download a great book written by Charles Pfeil when he was an engineering director at Mentor. BGA Breakouts and Routing: Effective Design Methods for Very Large BGAs can be downloaded from Mentor’s library, and print copies are available for purchase from Amazon. Charles covers all of the options and boundary conditions that can come up, and he discusses the topic in the details that it requires.
To pose your question for Happy Holden, take the survey by clicking here.
Suggested Items
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
09/15/2023 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023.
UK Space Agency Launches Consultation on Variable Liability Limits for Orbital Operations
09/15/2023 | UK Space AgencyThe proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
09/14/2023 | MediaTekMediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech Unveils New BRIDGE Solutions to Increase Access to Global Hybrid Connectivity
09/12/2023 | Business WireComtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.