Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

OKI Develops 124-Layer PCB Technology for Next-Generation AI Semiconductor Testing Equipment

04/28/2025 | BUSINESS WIRE
OKI Circuit Technology, the OKI Group printed circuit board (PCB) company, has successfully developed 124-layer PCB technology for wafer inspection equipment designed for next-generation high bandwidth memory, such as HBM mounted on AI semiconductors.

Airbus Signs Definitive Agreement with Spirit AeroSystems

04/28/2025 | Airbus
Airbus SE has entered into a definitive agreement with Spirit AeroSystems for the acquisition of industrial assets dedicated to its commercial aircraft programmes.

KYZEN to Feature Stencil Cleaning and Aqueous Cleaners at SMTA Capital Expo and Tech Form

04/28/2025 | KYZEN'
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Capital Expo and Tech Forum, scheduled to take place Thursday, May 8 at George Mason University – Mason Square in Arlington, VA.

Amtech Boosts Capabilities with New SMT Lines and Advanced Batch Washing System

04/25/2025 | Amtech
Amtech Electrocircuits, a leading provider of manufacturing solutions, has announced a major upgrade to its production capabilities with the installation of multiple new SMT (Surface Mount Technology) lines and a state-of-the-art batch washing system.

LITEON, Elephantech Deepen Partnership to Further Drive Innovation and End-to-End Sustainability

04/24/2025 | LITEON Technology
LITEON Technology has signed a second Memorandum of Understanding (MoU) with Elephantech, deepening their strategic partnership in advancing green Printed Circuit Boards (PCB) manufacturing. Announced on Earth Day (April 22), the renewed collaboration highlights their joint commitment to achieving net-zero carbon emissions.
Copyright © 2025 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in