-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Innovators Create Flexible, Printed Coil for Stringed Instruments
September 10, 2020 | Purdue UniversityEstimated reading time: 2 minutes
The wires inside an electric guitar to help produce quality sound can stretch for miles – even the length of a university campus. The copper wire, with the diameter of a human hair, is wrapped around magnets inside the guitar via a tedious and time-consuming process.
Now, Purdue University innovators have developed a solution to cut down that process and make the finished products better for players and manufacturers.
The team created a flexible, printed circuit board that imitates the conventional wire configurations inside an electric guitar. Existing guitars can be retrofitted with this innovation. The technology also has applications for other stringed instruments.
“We came up with a new approach to the electric guitar pickup – the magnetic transducer that helps create the musical sound,” said Davin Huston, an assistant professor of practice in engineering technology in the Purdue Polytechnic Institute. “Our circuit boards can be printed in large quantities and fit inside just about any electric guitar, which simplifies the manufacturing process but keeps the sound quality and reliability.”
The other members of the Purdue innovation team include Mark French, a professor of mechanical engineering technology in Purdue Polytechnic, and Kathryn Smith, a former graduate student in Huston’s lab.
The Purdue team’s circuit board works in the same general way as a conventional electric guitar pickup – string vibrations cause the electromagnetic field to oscillate and induce a voltage in the stationary coil. The electric signal generated is then carried to a power amplifier and speaker.
“With typical pickups, the wire coils often produce undesired feedback and need to be potted with wax or a polymer,” French said. “Our circuit board provides an alternative that is easier to produce with manufactured consistency.”
The team worked with the Purdue Research Foundation Office of Technology Commercialization to patent the technology. A U.S. patent has been granted on this technology.
The creators are looking for partners to continue developing their technology and license it. For more information, contact D.H.R. Sarma of OTC at dhrsarma@prf.org and reference track code 2013-HUST-66596.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Driving Innovation: Selecting the Right Laser Source
04/28/2026 | Simon Khesin -- Column: Driving InnovationWhen I first joined Schmoll Maschinen, I brought experience from almost every PCB process, except for laser. As I immersed myself in laser processing, I realized why it can seem so daunting to a newcomer. The complexity arises from three intersecting factors: A vast variety of laser sources: CO2, UV-nano, green-pico, UV-pico, IR-pico, and others; a diverse range of applications: Drilling, cutting, ablation, and more; and an extensive list of materials: These have vastly different absorption rates. Choosing the right machine or laser source is rarely trivial. Even for experienced engineers, answering "Which source is best?" requires examining the business's specific goals.
Institute of Circuit Technology Spring Seminar 2026: A Bright Future in Europe
04/23/2026 | Pete Starkey, I-Connect007Through the leafy lanes and spring flowers of Warwickshire and back to Meridan, the traditional centre of England, and now officially part of the Metropolitan Borough of Solihull in the county of the West Midlands, I attended the Annual General Meeting and Spring Seminar of the Institute of Circuit Technology (ICT) on April 14. Out of the AGM came notable changes in leadership at the top of the Institute: the retirement of Mat Beadel as chair and Emma Hudson as technical director. Effective May 1, Steve Driver is the new chair, and Alun Morgan is the new technical director.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.
Fresh PCB Concepts: Designing PCBs for Harsh Environments—Reliability Is Engineered Upstream
04/23/2026 | Team NCAB -- Column: Fresh PCB ConceptsWhen engineers hear the phrase “harsh environment,” they usually think of the extreme temperature swings, vibration and shock, pressure changes, or radiation in aerospace. However, aerospace is not the only harsh environment where electronic assemblies must survive. Automotive power electronics, downhole oil and gas tools, marine controls, rail systems, defense platforms, and industrial automation equipment all expose PCBs to environments that are equally unforgiving. The stress mechanisms may differ, but the physics does not.
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.