-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Real Time with… IPC APEX EXPO: Siemens’ Supply Chain Solutions
January 17, 2022 | Nolan Johnson, I-Connect007Estimated reading time: 6 minutes
Nolan Johnson speaks with Oren Manor of Siemens Digital Industries Software about the company’s booth at IPC APEX EXPO, which will highlight a DSI platform meant to help designers find and use components in their designs during these tough supply chain challenges.
If you can’t make it to IPC APEX EXPO, don’t worry. We’ll be bringing you interviews with the engineers, managers and technologists who are making a difference in our industry.
To listen to this Real Time with… IPC APEX EXPO interview with Oren Manor, click here.
Nolan Johnson: Hi. Nolan Johnson here for Real Time with… IPC APEX EXPO. I’m speaking with Oren Manor, the director of business development to the Siemens Industrial Software and Digital Manufacturing. Oren, welcome.
Oren Manor: Thanks. Great to be here.
Johnson: We’re here to discuss APEX. And Siemens will be present at the show. What are you bringing to the show floor in San Diego?
Manor: We’re going to be bringing a suite of applications. And some of our focus this year is going to be around the supply chain challenges that are still running through the industry. We’re still seeing the shortage of components. And we really have quite a number of applications which are there to try to address this challenge, which we’ve seen last year, is continuing this year. Probably also, we foresee to be with us maybe even for another year after. And we have, of course, Supplyframe, the latest acquisition that Siemens did last year.
So, the booth is really going to be with Supplyframe and Siemens together, and we’re going to be showcasing the Supplyframe DSI platform, designed to source intelligence and all the capabilities that they bring. And we’re also going to show how some of the Supplyframe data has already integrated into the Siemens applications, allowing our customers running design for manufacturing analysis, programming, different types of machines, doing different type of quoting and costing to use some of Supplyframe data regarding availability, regarding price regarding alternatives, in order to make supply chain decisions through the process—whether it’s at the design phase, whether it’s the handoff before, whether it’s in the pre-production, whether you’re just thinking of where you’re going to manufacture this and how you’re going to manufacture it, or if it’s really on the floor, just you’re going to start and you have to finalize all of your acquisitions and so on. So that’s definitely something that we’re going to be focusing on.
Johnson: Supplyframe sounds quite intriguing, Oren. Where does that fit in the overall business operations model for a company?
Manor: Supplyframe, I mean, first of all, works with OEMs. OEMs, when they’re planning a design and doing some initial conceptual design and they’re starting, that’s really where Supplyframe brings them a lot of insights regarding making decisions around the BOM. You select your discreet components, your microprocessors, and your capacitors. And if you look at the life cycle, end of life, and availability, and you know you’re going to be doing most of the manufacturing in Mexico, then Supplyframe might tell you that this component is very hard to get outside of Southeast Asia. If you’re going to be making this product mostly in Eastern Europe, Supplyframe might tell you these components are available in the Americas, but not easy to get in Europe.
So, you can make these decisions. You can see that this component, for example, is going to be end of life in about a year. If you are planning a three-to-five-year program, maybe this is not out the best component for you. Also, it will allow you to select multiple alternatives. Maybe if in the past we could survive with dual alternatives, we see now that this crunch in the availability of components, one thing is to just select more and more alternative components to give you the agility and flexibility when you get to the production later on.
Johnson: This certainly has been an ongoing issue for the industry.
Manor: And then of course, Supplyframe also joins us in manufacturing, where you have the design, and you actually have to now source it. Again, you can use a lot of their insights to understand, “Where should I source it from? Who has more availability? Is it Avnet? Is it DigiKey? Is it Arrow? What kind of prices can I get directly from the chip vendor? How does the pricing look like now?” We’ve always had long lead items and we’ve also always had strategic sourcing. But my feeling is, today, the situation is so grim, the entire BOM is basically a long lead item. And if you don’t do strategic sourcing for your entire BOM across all your products, then you cannot manufacture as much as you want. And we’re seeing that our manufacturers, if they need to do a batch of 1,000, they only do 800 because that’s what they can source, and they do the missing 200 next week.
That leads us to the other challenge that the mix is going even higher, lot sizes are shrinking because you can’t source components since people want to get the products into the market and there’s a crazy demand for electronics in vehicles and EVs. So, they’re making ECOs. They’re changing the design, they’re altering their BOM. They’re bringing in different components, very similar, but not identical. And then they’re telling the manufacturers, “Okay, just run with this component.” But then it turns out that that component has a different supply form, the pins are slightly different, this stencil doesn’t match, and you start seeing quality issues. We’re going to show how we have the tools to really help us cope with the high level, try to minimize the ECOs up front, but also try to minimize the impact on the process of all of these ECOs on the shop floor.
Johnson: I take it you will have a series of demos available for interested people?
Manor: Exactly. We will have demos available for this whole Supplyframe. We will be focusing on our DFM analysis, of course, the whole process engineering, and of course Op Center, which is our consolidated MES and real manufacturing operations platform, including our analytics, our ability to do low code cloud development, getting all the data from the machines. The connectivity will be showing that and really showing how all of the data flow through all the applications so we’re really one of the best in the industry to take an enterprise and digitalize this whole design through manufacturing flow.
Johnson: That is going to be a very interesting conversation to be having on the show floor. I certainly am interested in finding out more about what you have to say. Thank you for taking the time to speak with us, Oren.
Manor: Sure. Keep safe. And I hope to see you soon.
Johnson: Once again, I’ve been speaking with Oren Manor. He’s the director of business development for Siemens Industrial Software and Digital Manufacturing. Thanks for listening.
Check out this additional content from Siemens Digital Industries Software:?
- The Printed Circuit Assembler's Guide to ...Smart Data: Using Data to Improve Manufacturing?by Sagi Reuven and Zac Elliott (a free eBook available for download)?
- The Printed Circuit Assembler's Guide to… Advanced Manufacturing in the Digital Age? by Oren Manor (a free eBook available for download)?
- The Printed Circuit Designer’s Guide to… PowerIntegrity by Example by Fadi Deek (a free eBook available for download)
- Siemens’ free, 12-part, on-demand webinar series?“Implementing Digital Twin Best Practices?From?Design Through Manufacturing.”?
- RealTime?With ...?Siemens and Computrol: Achieving Operational Excellence in Electronics Manufacturing?
- You can also view other titles in our full I-007eBook library here
Suggested Items
Standard of Excellence: Hiring for Quality Positions in Manufacturing, Engineering, and Management
11/25/2024 | Anaya Vardya -- Column: Standard of ExcellenceIn continuing my series on finding, signing, and keeping good people for your company, this month we discuss hiring good people for your quality department. Even when hiring was easier, hiring for the quality department has always been especially challenging. It takes a special kind of person: someone with attention to detail, someone ready to stand for his or her convictions, and someone who can stand up under pressure when the company needs to ship product and the quality manager refuses to because it is not up to par. The quality department is the very soul of any manufacturing company.
China Overtakes Germany and Japan in Robot Density
11/22/2024 | IFRChina's adoption of robots continues at a rapid pace: The country has surpassed Germany and Japan in the ratio of robots to factory workers, taking third place in the world in 2023.
PCB Design Software Market Expected to Hit $9.2B by 2031
11/21/2024 | openPRThis report provides an overview of the PCB design software market, detailing key market drivers, challenges, technological advancements, regional dynamics, and future trends. With a projected compound annual growth rate (CAGR) of 13.4% from 2024 to 2031, the market is expected to grow from USD 3.9 billion in 2024 to USD 9.2 billion by 2031.
SIA Applauds CHIPS Award for Semiconductor Research Corporation’s SMART USA Institute
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer commending the announcement that the U.S. Department of Commerce and the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) are entering negotiations for the Commerce Department to provide SRC $285 million to establish and operate the CHIPS Manufacturing USA Institute for Digital Twins.
SIA Praises Finalization of CHIPS Investments for GlobalFoundries Manufacturing Projects
11/21/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding finalization of semiconductor manufacturing investments announced by the U.S. Department of Commerce and GlobalFoundries.