-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueProper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Isola Lays Foundations for Faster Circuits at DesignCon 2022
March 28, 2022 | Isola GroupEstimated reading time: 2 minutes
Isola Group, an innovative developer and supplier of top-quality printed circuit boards (PCB) materials, will be exhibiting at the upcoming DesignCon 2022 expo and conference. The event, scheduled for April 5-7, 2022, at the Santa Clara Convention Center (Santa Clara, CA), provides visitors with the chance to learn more about Isola’s reliable, high-performance circuit materials and how they can form the foundations for miniature circuit solutions engineered for the most efficient and practical manufacturing processes.
Isola Group will be well represented at exhibition booth #743, with details and data about its extensive portfolio of circuit materials. The event, in the heart of the historic “Silicon Valley” area of northern California, features a 14-track technical conference and large exhibition area. It is promoted as “Where the Chip Meets the Board,” and Isola is a leading supplier of materials for “the board.” The show highlights the latest, fastest-growing markets in electronics, including Fifth Generation (5G) wireless cellular communications with a growing demand for circuit materials for 5G infrastructure equipment and mobile devices.
Isola’s “material masters” will be on hand to share insights on their premium circuit materials for high-speed-digital (HSD) and RF/microwave (RF/MW) circuits. HSD circuit materials include I-Speed®, I-Tera® MT40, Tachyon® 100G and, for those developing low-loss, halogen-free circuits, the new high-speed TerraGreen® 400G laminates and prepregs, for designs requiring high-level SI performance to 100 Gb/s and beyond. Circuit materials for high-frequency RF/MW circuits include Astra® MT77, I-Tera® MT40 (RF/MW), and IS680/IS680 AG laminates. Standard TerraGreen® circuit materials provide a halogen-free choice for many general-purpose circuits while TerraGreen® 400G (RF/MW) circuit materials offer the halogen-free option at RF, microwave, and higher frequencies. These extremely low-loss circuit materials support circuits into the millimeter-wave (mmWave) frequency range, to 110 GHz.
Since the challenging combination of high circuit density and miniaturization is a growing trend for HSD and RF/MW circuits, visitors to the Isola booth can learn how to combine both types of circuits into compact hybrid PCBs that support multiple-signal operation with multiple-material solutions. Time at the Isola booth can lead to improved understanding of the different circuit materials needed for modern electronic products requiring both HSD and RF/MW circuits, and how compatibility of essential material characteristics, such as coefficient of thermal expansion (CTE), can enable the reliable, long-term coexistence of different circuit materials on a hybrid PCB. High-frequency circuit materials such as Astra® MT77 and I-Tera® MT40 are also FR-4 process compatible for ease of hybrid circuit fabrication.
Download The Printed Circuit Designer’s Guide to... High Performance Materials by Michael Gay. You can also view other titles in our full I-007eBook library here.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Insulectro and Electroninks Sign North American Distribution Agreement
08/12/2025 | InsulectroElectroninks, a leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, today announced a strategic collaboration and distribution partnership with Insulectro, a premier distributor of materials used in printed electronics and advanced interconnect manufacturing.
Happy’s Tech Talk #41: Sustainability and Circularity for Electronics Manufacturing
08/13/2025 | Happy Holden -- Column: Happy’s Tech TalkI attended INEMI’s June 12 online seminar, “Sustainable Electronics Tech Topic Series: PCBs and Sustainability.” Dr. Maarten Cauwe of imec spoke on “Life Cycle Inventory (LCI) Models for Assessing and Improving the Environmental Impact of PCB Assemblies,” and Jack Herring of Jiva Materials Ltd. spoke on “Transforming Electronics with Recyclable PCB Technology.” This column will review information and provide analysis from both presentations.
Dymax Renews Connecticut Headquarters Lease, Reinforces Long-Term Commitment to Local Community
08/08/2025 | DymaxDymax, a global manufacturer of rapid light-curing materials and equipment, is pleased to announce the renewal and extension of its corporate lease at its 318 Industrial Lane, Torrington, headquarters.
EMC Taiwan Receives IPC-4101 Qualified Products Listing Certification
08/08/2025 | Global Electronics AssociationIPC’s Validation Services Program has awarded an IPC-4101 Qualified Products Listing (QPL) to Elite Materials Co. (EMC), an electronics base material manufacturing company headquartered in Taoyuan City, Taiwan.
DuPont Reports Second Quarter 2025 Results
08/06/2025 | PRNewswireNet sales increased 3% led by organic sales growth of 2% which consisted of a 4% increase in volume partially offset by a 2% decrease in price. Currency was a 1% benefit.