-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Isola Lays Foundations for Faster Circuits at DesignCon 2022
March 28, 2022 | Isola GroupEstimated reading time: 2 minutes
Isola Group, an innovative developer and supplier of top-quality printed circuit boards (PCB) materials, will be exhibiting at the upcoming DesignCon 2022 expo and conference. The event, scheduled for April 5-7, 2022, at the Santa Clara Convention Center (Santa Clara, CA), provides visitors with the chance to learn more about Isola’s reliable, high-performance circuit materials and how they can form the foundations for miniature circuit solutions engineered for the most efficient and practical manufacturing processes.
Isola Group will be well represented at exhibition booth #743, with details and data about its extensive portfolio of circuit materials. The event, in the heart of the historic “Silicon Valley” area of northern California, features a 14-track technical conference and large exhibition area. It is promoted as “Where the Chip Meets the Board,” and Isola is a leading supplier of materials for “the board.” The show highlights the latest, fastest-growing markets in electronics, including Fifth Generation (5G) wireless cellular communications with a growing demand for circuit materials for 5G infrastructure equipment and mobile devices.
Isola’s “material masters” will be on hand to share insights on their premium circuit materials for high-speed-digital (HSD) and RF/microwave (RF/MW) circuits. HSD circuit materials include I-Speed®, I-Tera® MT40, Tachyon® 100G and, for those developing low-loss, halogen-free circuits, the new high-speed TerraGreen® 400G laminates and prepregs, for designs requiring high-level SI performance to 100 Gb/s and beyond. Circuit materials for high-frequency RF/MW circuits include Astra® MT77, I-Tera® MT40 (RF/MW), and IS680/IS680 AG laminates. Standard TerraGreen® circuit materials provide a halogen-free choice for many general-purpose circuits while TerraGreen® 400G (RF/MW) circuit materials offer the halogen-free option at RF, microwave, and higher frequencies. These extremely low-loss circuit materials support circuits into the millimeter-wave (mmWave) frequency range, to 110 GHz.
Since the challenging combination of high circuit density and miniaturization is a growing trend for HSD and RF/MW circuits, visitors to the Isola booth can learn how to combine both types of circuits into compact hybrid PCBs that support multiple-signal operation with multiple-material solutions. Time at the Isola booth can lead to improved understanding of the different circuit materials needed for modern electronic products requiring both HSD and RF/MW circuits, and how compatibility of essential material characteristics, such as coefficient of thermal expansion (CTE), can enable the reliable, long-term coexistence of different circuit materials on a hybrid PCB. High-frequency circuit materials such as Astra® MT77 and I-Tera® MT40 are also FR-4 process compatible for ease of hybrid circuit fabrication.
Download The Printed Circuit Designer’s Guide to... High Performance Materials by Michael Gay. You can also view other titles in our full I-007eBook library here.
Suggested Items
Taiwan's PCB Industry Chain Is Expected to Grow Steadily by 5.8% Annually in 2025
05/05/2025 | TPCAAccording to an analysis report jointly released by the Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute's International Industrial Science Institute, the total output value of Taiwan's printed circuit (PCB) industry chain will reach NT$1.22 trillion in 2024, with an annual growth rate of 8.1%.
New Database of Materials Accelerates Electronics Innovation
05/05/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.
DuPont Exceeds Quarterly Profit Expectations as Electronics Segment Benefits from Semiconductor Demand
05/05/2025 | I-Connect007 Editorial TeamDuPont reported higher-than-expected earnings for the first quarter of 2025, supported by increased demand in its electronics and industrial segments. The company’s adjusted earnings per share came in at 79 cents, surpassing the average analyst estimate of 65 cents per share, according to data from LSEG.
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
New Database of Materials Accelerates Electronics Innovation
05/02/2025 | ACN NewswireIn a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers.