- design007 Magazine
Latest IssuesCurrent Issue
In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
- Events||| MENU
- design007 Magazine
Isola Lays Foundations for Faster Circuits at DesignCon 2022March 28, 2022 | Isola Group
Estimated reading time: 2 minutes
Isola Group, an innovative developer and supplier of top-quality printed circuit boards (PCB) materials, will be exhibiting at the upcoming DesignCon 2022 expo and conference. The event, scheduled for April 5-7, 2022, at the Santa Clara Convention Center (Santa Clara, CA), provides visitors with the chance to learn more about Isola’s reliable, high-performance circuit materials and how they can form the foundations for miniature circuit solutions engineered for the most efficient and practical manufacturing processes.
Isola Group will be well represented at exhibition booth #743, with details and data about its extensive portfolio of circuit materials. The event, in the heart of the historic “Silicon Valley” area of northern California, features a 14-track technical conference and large exhibition area. It is promoted as “Where the Chip Meets the Board,” and Isola is a leading supplier of materials for “the board.” The show highlights the latest, fastest-growing markets in electronics, including Fifth Generation (5G) wireless cellular communications with a growing demand for circuit materials for 5G infrastructure equipment and mobile devices.
Isola’s “material masters” will be on hand to share insights on their premium circuit materials for high-speed-digital (HSD) and RF/microwave (RF/MW) circuits. HSD circuit materials include I-Speed®, I-Tera® MT40, Tachyon® 100G and, for those developing low-loss, halogen-free circuits, the new high-speed TerraGreen® 400G laminates and prepregs, for designs requiring high-level SI performance to 100 Gb/s and beyond. Circuit materials for high-frequency RF/MW circuits include Astra® MT77, I-Tera® MT40 (RF/MW), and IS680/IS680 AG laminates. Standard TerraGreen® circuit materials provide a halogen-free choice for many general-purpose circuits while TerraGreen® 400G (RF/MW) circuit materials offer the halogen-free option at RF, microwave, and higher frequencies. These extremely low-loss circuit materials support circuits into the millimeter-wave (mmWave) frequency range, to 110 GHz.
Since the challenging combination of high circuit density and miniaturization is a growing trend for HSD and RF/MW circuits, visitors to the Isola booth can learn how to combine both types of circuits into compact hybrid PCBs that support multiple-signal operation with multiple-material solutions. Time at the Isola booth can lead to improved understanding of the different circuit materials needed for modern electronic products requiring both HSD and RF/MW circuits, and how compatibility of essential material characteristics, such as coefficient of thermal expansion (CTE), can enable the reliable, long-term coexistence of different circuit materials on a hybrid PCB. High-frequency circuit materials such as Astra® MT77 and I-Tera® MT40 are also FR-4 process compatible for ease of hybrid circuit fabrication.
Download The Printed Circuit Designer’s Guide to... High Performance Materials by Michael Gay. You can also view other titles in our full I-007eBook library here.
Indium Corporation advisor, and founder/principal of DS&A LLC, Dave Saums will present on innovative thermal materials for semiconductor testing at TestConX 2024, held in Mesa, AZ, March 3-6.
Key Supplier for Mechanical and Optical Processes in the New Teltonika PCB Factory – Schmoll Maschinen GmbH02/14/2024 | Schmoll Maschinen
Schmoll Maschinen is very happy to become the business partner of Teltonika and to become part of one of the biggest projects in the PCB industry in Europe for the last 5 years.
Kerafol and X2F are teaming up to develop state-of-the-art thermal management solutions for electronic devices by leveraging the advantages of Kerafol's thermally conductive materials and X2F's patented controlled-viscosity molding technologies.
Heraeus Electronics, a leading provider of advanced materials solutions, is pleased to announce the successful acquisition of the PriElex electronics inks business line from Kayaku Advanced Materials Inc.
The designer needs to have a working understanding of two key manufacturing operations: basic circuit board fabrication procedures and assembly process practices. For printed circuit board manufacturing, the number of steps required to produce the printed circuit board correlates to the circuit board's complexity. Greater process complexity in fabricating the circuit board equates to increased costs. To develop any portion of the electronic product, the designer must apply the design for manufacturing (DFM) principles established in the industry. In fact, DFM should always be the goal of the design engineer. It encompasses a wide range of disciplines that must be considered during the planning phase of any product.