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In this issue, we discuss some of the challenges, pitfalls and mitigations to consider when designing non-standard board geometries. We share strategies for designing odd-shaped PCBs, including manufacturing trade-offs and considerations required for different segments and perspectives.
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Zuken's eCADSTAR Release 2022 Enables Efficient Creation of IoT Enabled PCB DesignsJune 16, 2022 | Zuken
Estimated reading time: Less than a minute
With Release 2022 of eCADSTAR, Zuken continues to advance the concept of a user-friendly, internet-connected PCB design system for the small and medium business segment.
Leveraging eCADSTAR’s internet connected platform and unified user interface for all applications (schematic, constraint, library and layout editors), the eCADSTAR development team’s focus for the new major release was the delivery of advanced functionality as a reaction to requests from the growing user base. Focus for the new major release was the delivery of advanced capabilities for organization and reuse of designs, fine-tuning of high-speed circuitry, and layout and modification of densely populated PCB layouts through semi-automatic functionality.
“With an emphasis on organization and reuse of full and partial designs, advanced fine-tuning of high-speed circuitry, and automation-assisted layout and modification of densely populated PCB layouts, eCADSTAR release 2022 continues to be a strong contender for demanding users in the growing market of IoT enabled boards,” says Jeroen Leinders, eCADSTAR Business Manager Europe.
Test Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023.
The proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 202409/14/2023 | MediaTek
MediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.