-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueDesigning Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
IPC Lauds Passage of 'CHIPS and Science' Act; Electronics Industry Calls for a Holistic Approach to Reviving Domestic Electronics Capabilities
August 9, 2022 | IPCEstimated reading time: 2 minutes

The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden’s signature today on the “CHIPS and Science Act” in Washington, D.C.:
“Electronics manufacturers are pleased that this bill has become law, and they welcome the added innovation and resiliency it will bring to the global electronics supply chain. Billions of people will benefit from faster, more secure access to the next-generation technologies that this bill will help to speed to market.
“We are especially pleased that the bill includes at least $2.5 billion for a new National Advanced Packaging Manufacturing Program, which is aimed at making the United States a world leader in the post-Moore’s-Law only era of microelectronics. In the mid-1960s, Intel founder Gordon Moore predicted that the number of transistors that would fit into an integrated circuit would double about every two years, allowing the production of ever more powerful electronic products with greater cost efficiencies. Moore’s Law held true for decades, but today, is dying, and designers are increasingly relying on advancements in the packaging of silicon chips into ever-smaller integrated devices to achieve the greater functionality and efficiencies that they previously realized through silicon scaling. Today, packaging is king, and this legislation will help position the United States as a leader in this crucial technology. [Read more about advanced packaging in this IPC report.]
“Most urgently, the United States needs to invest in the development and production of the most advanced integrated circuit (IC) substrates, i.e., circuit board surfaces, for which there are only nascent capabilities domestically.
“Companies engaged in standing up packaging and IC substrate facilities will have opportunities to tap into U.S. Government funding for R&D, new facilities, and workforce training through the programs funded by this bill. IPC is urging federal officials to structure these initiatives to deliver benefits holistically across the electronics manufacturing industry. Increasing domestic chips production without bolstering related manufacturing capabilities will actually lengthen the semiconductor supply chain, as chips made in California or Ohio will still need to be sent to Taiwan, Japan, or South Korea for packaging and assembly into finished products.
“It’s also important to keep in mind this is only one step in a long journey toward rebuilding the U.S. electronics manufacturing industry. The Executive Branch and Congress must continue to support – through long-term policy and funding – the larger ecosystem that sustains innovative, resilient, and secure electronics manufacturing.”
For more information, visit www.IPC.org.
Suggested Items
Real Time with... IPC APEX EXPO 2025: IPC's Growth and Future in India's Manufacturing Sector
04/23/2025 | Real Time with...IPC APEX EXPOGaurab Majumdar, VP for IPC in SE Asia and India, highlights IPC's impressive growth in India, with certification numbers rising significantly. The Indian manufacturing sector is projected to reach a $300 billion market, alongside a $10 billion investment in semiconductors. IPC is addressing industry demands through standards development and a new workforce project aimed at training students for job placements.
Real Time with... IPC APEX EXPO 2025: DuPont Electronics Materials and Innovations
04/23/2025 | Real Time with...IPC APEX EXPODuPont is many things to many markets, but DuPont Electronics Materials is, perhaps, a bit out of the DuPont "norm," developing specialized electronic materials that are particularly focused on challenging areas such as flex circuits, high power PCBs and products that must withstand harsh environments. At IPC APEX EXPO, Marcy LaRont sat down with Shannon Dugan from DuPont Electronics Materials to discuss some big news. They are being spun off into an independent entity with a new CEO having just been announced as the show wrapped.
SERMA Microelectronics Expand its Facilities in La Rochelle
04/22/2025 | SERMA MicroelectronicsSERMA Microelectronics, a major player in specialized microelectronics, continues its growth with the acquisition of a building adjacent to its current site in La Rochelle.
UHDI Fundamentals: UHDI Drives Unique IoT Innovation in Farming
04/22/2025 | Anaya Vardya, American Standard CircuitsThe combination of UHDI's high-bandwidth capabilities and IoT's real-time data processing can lead to more efficient, immersive, and smarter IoT systems. This convergence of two revolutionary technologies is enabling quantum advancements in some very “unconventional” applications. The typical discussions around UHDI focus on our standard electronics industry market segments like milaero, medical, consumer electronics, etc. IoT is all about machines talking to other machines, machine learning, and artificial intelligence, but again, typically applied in our PCB and assembly operations.
Navigating Change, Mitigating Risk: We’ve Been Here Before
04/22/2025 | Marcy LaRont, PCB007 MagazineI visited with Tom Edman, president and CEO of TTM Technologies, and chair of the IPC Board of Directors. Tom candidly shares his insights into the implications of changes on the defense sector and the broader electronics manufacturing industry, especially concerning PCB manufacturing. With half of TTM’s business tied to defense, Tom discusses the potential opportunities and challenges arising from government initiatives, tariffs, and supply chain complexities.