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Sparton Received Vendor Status for U.S. Navy Sonobuoy Orders
August 15, 2022 | Sparton Corp.Estimated reading time: 1 minute
Sparton Corporation, an Elbit Systems of America company, announced that it had received a vendor status under the United States Navy’s sonobuoy Multiple Award Delivery Order Contract (MADOC). With MADOC vendor status, Sparton qualifies to compete for annual delivery orders for each sonobuoy variant that may be needed by the service.
Sparton President and CEO Tracy Howard, said “The U.S. Navy’s sonobuoy MADOC is a significant award and is a testament to our longtime support of the U.S. Navy’s Maritime Undersea Warfare campaign. We are proud to continue to provide reliable, cost-effective, and technologically advanced sensors to our Warfighters whenever called upon.”
Sparton has been a trusted sonobuoy supplier since 1951. Sonobuoys are expendable sensors deployed by Anti-Submarine Warfare (ASW) aircraft and used to detect underwater sound. Sparton is a world leader in the design, development, testing and production of complex maritime electronic systems including sonobuoys in support of ASW.
“Our mission at Elbit Systems of America is to help protect and save lives and to strengthen U.S. national security with our solutions”, said Elbit Systems of America President and CEO Raanan Horowitz. “Sparton’s sonobuoys provide American forces the critical technology needed to execute their missions at sea with a full operating picture.”
Sparton was purchased by Elbit Systems of America in 2021, adding their extensive maritime capabilities to the company’s diverse enterprise that spans airborne and land-based solutions, homeland security, medical instrumentation, and more.
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Julia McCaffrey - NCAB GroupSuggested Items
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
RTX's Raytheon Completes First Flight Test for RAIVEN® Sensing System
04/15/2026 | RTXRaytheon, an RTX business, has successfully completed the first flight test of its RAIVEN® Staring system, an air-cooled sensor suite that delivers greater situational awareness and operator survivability, on a UH-60 Black Hawk helicopter.
HYFIX Raises $15M to Build U.S.-Made Chips for Next-Gen Drones and Robots
04/15/2026 | PRNewswireHYFIX Spatial Intelligence, Inc., a U.S.-based semiconductor company, announced a $15 million seed round to build and manufacture a new class of American-made chips designed to power high-precision drones and autonomous robots.
Carbice Awarded Multi-Million Dollar U.S. Navy Contract for Thermal Assembly Joint Technology
04/14/2026 | PRNewswireCarbice, a U.S.-based manufacturer and supplier of novel multifunctional assembly joint technologies, has been awarded a multi-million dollar contract by the U.S. Navy's Office of Naval Research.
Powering the Future: Why Thermal Management Defines the Future of Electronics
04/15/2026 | Brian Buyea -- Column: Powering the FutureEvery leap forward in electronics comes with a familiar consequence: heat. Whether it’s a power module driving an electric vehicle, a laser diode used in surgery, or a 5G amplifier operating in orbit, higher performance inevitably means higher temperatures. While engineers celebrate breakthroughs in speed, density, and power, none of those specifications matter if the system can’t keep cool long enough to perform reliably.