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Department of Commerce Awards CHIPS Incentives to Micron for Idaho and New York Projects

12/12/2024 | U.S. Department of Commerce
The Biden-Harris Administration announced that the U.S. Department of Commerce awarded Micron Technology up to $6.165 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities. The award follows the previously signed preliminary memorandum of terms, announced on April 25, 2024, and the completion of the Department’s due diligence.

OKI Develops PCB Technology with Stepped Copper Coin Insertion to Achieve 55 Times Better Heat Dissipation in Outer Space

12/12/2024 | BUSINESS WIRE
The OKI Group printed circuit board (PCB) business company OKI Circuit Technology has successfully developed multi-layer PCB technology with stepped copper coin insertion to achieve 55 times better heat dissipation compared to conventional PCB.

Real Time with... electronica 2024: STARTEAM GLOBAL Meeting Challenges Head-on

12/11/2024 | Real Time with... electronica
STARTEAM GLOBAL CEO Daniel Jacob and CTO Martin Schneider speak with Pete Starkey at electronica 2024 about their global presence in China, Thailand, and Europe, and how additive manufacturing and inkjet printing are keeping this PCB manufacturer at the forefront of technology. They’re excited about sustainability, the future, and competing on the world stage.

Lockheed Martin’s Newest Technology Demo for Space Connectivity Is Ready for Launch

12/10/2024 | Lockheed Martin
Lockheed Martin’s newest technology demonstration, called the Tactical Satellite (TacSat), is complete and ready for launch in 2025 aboard a Firefly Aerospace Alpha rocket.

The Shaughnessy Report: A Stack of Advanced Packaging Info

12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy Report
It’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.
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