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Nortech Systems Announces Patent for Flexible Faraday Cage PCB and Cable
August 26, 2022 | Nortech SystemsEstimated reading time: 1 minute
Nortech Systems Incorporated, a leading provider of engineering and manufacturing solutions for complex electromedical and electromechanical products serving the medical, industrial and defense markets, announced this week that the US Patent Office has issued Patent No. 11,412,608, for the Company’s Flex Faraday Xtreme™, a flexible printed circuit for transmitting high-frequency signals while precisely controlling both crosstalk and impedance, minimizing electromagnetic interference, improving parallel transmission alignment, and increasing data density. This work is based on the important work of Michael Faraday in the 1830s that contributed to our current understanding of shielding effects of what we now call a Faraday Cage.
“Nortech’s commitment to innovative technologies is key to supporting our strategic medical, industrial, and defense customers,” said Jay D. Miller, Chief Executive Officer and President. “In highly complex and compact devices, the FFX is designed to provide the signal integrity necessary to support sensitive, mission-critical applications.”
“With our patent of the Flex Faraday Xtreme (FFX), Nortech provides intelligent transmission lines that provide benefits over traditional micro coax cables in challenging applications,” said Steve Czeck, Senior Director of Engineering. “FFX technology will be applied to meet customer requirements for size or weight constraints, or where harsh conditions exist.”
Both FFX and the recent Active Optical Xtreme™ product launch are early steps in the Company’s long-term pivot toward serving strategic customers by building higher level assemblies that contain advanced technologies and solve difficult connectivity challenges. Invented by Scott Blanc, Principal Engineer, FFX is the Company’s first patent in its technology portfolio. FFX adoption will ramp up through 2023 and will not have a material impact on Nortech's 2022 or 2023 financial results.
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The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.