Dan's Biz Bookshelf: 'Revenge of the Tipping Point'
Marcy's Musings: Engineering Economics
Punching Out: Should You Sell Your Company to a Private Equity Firm?
Snapdragon Powers Samsung’s New Galaxy Lineup Globally
July 27, 2023 | Qualcomm Technologies, Inc.Estimated reading time: 2 minutes
Qualcomm Technologies, Inc. announced that its flagship Snapdragon® 8 Gen 2 Mobile Platform for Galaxy is powering Samsung Electronics Co., Ltd.’s new cutting-edge foldable smartphones, the Samsung Galaxy Z Fold5 and Galaxy Z Flip5, and its latest Galaxy Tab S9 Series. Snapdragon 8 Gen 2 for Galaxy defines a new standard for connected computing, including groundbreaking AI experiences, desktop-level gaming features, professional grade photography, and more, for consumers around the world.
“Samsung is important to our mission to deliver the world’s best mobile experiences to consumers. They continue to set the pace for innovation and we couldn’t be more thrilled to have Snapdragon 8 Gen 2 for Galaxy power the newest flagship Galaxy device lineup—the Galaxy Z Flip5, Galaxy Z Fold5, and Galaxy Tab S9 series,” said Alex Katouzian, senior vice president and general manager, mobile, compute, & XR businesses, Qualcomm Technologies, Inc.
“We believe the future of our products lies in delivering new and exciting experiences in a range of form-factors, all powered by the latest and greatest technology,” Inkang Song, vice president and head of technology strategy team, Samsung Electronics. “Samsung is proud to feature the latest flagship Snapdragon 8 Gen 2 for Galaxy inside the Galaxy Z Flip5, Galaxy Z Fold5, and Galaxy Tab S9 Series. We’re excited to see how these devices will enable new possibilities for our users.”
Snapdragon 8 Gen 2 – Technology Highlights
- Snapdragon® Smart: Samsung’s new Galaxy devices feature our fastest, most advanced Qualcomm® AI Engine providing groundbreaking AI integrated across the entire platform. Snapdragon 8 Gen 2 for Galaxy features an upgraded Qualcomm® Hexagon™ Processor that enables micro tile inferencing to help accelerate complex AI models for increased AI performance, and the latest Qualcomm® Sensing Hub with dual AI processors to support ultra-low power AI experiences like AI-based echo cancelling and noise cancellation during video and phone calls.
- Snapdragon Sight™: Snapdragon 8 Gen 2 for Galaxy helps to define a new era of professional quality camera experiences. Snapdragon’s Cognitive ISP enables real-time Semantic Segmentation1 to enhance images, ultra low-light video capture, and multi-frame noise reduction.
- Snapdragon® Gaming: The accelerated Qualcomm® Adreno™ GPU enables real time hardware-accelerated ray tracing to deliver life-like light, reflections, and illuminations in mobile games. With support for the latest Vulkan APIs (version 1.3), the Galaxy series enables improved graphics performance and helps developers accelerate the transition of desktop games to mobile.
- Multi-Gigabit Connectivity: The new Samsung Galaxy devices features Qualcomm Technologies’ leading connectivity solutions, including the Snapdragon® X70 Modem-RF System, and Qualcomm® FastConnect™ Mobile Connectivity Subsystem for high-speed and ultra-low latency Wi-Fi, and the latest Bluetooth audio enhancements.
Share on:
Suggested Items
TRI to Unveil New High-Throughput AOI and AXI at productronica 2023
09/15/2023 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, will join productronica 2023, which will be held at Messe München Center from November 14 – 17, 2023.
UK Space Agency Launches Consultation on Variable Liability Limits for Orbital Operations
09/15/2023 | UK Space AgencyThe proposals from the UK Space Agency follow a review into the UK’s approach to setting the amount of an operator’s liability in licences for orbital operations, a key commitment of the government’s National Space Strategy.
MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024
09/14/2023 | MediaTekMediaTek and TSMC announced that MediaTek has successfully developed its first chip using TSMC's leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
MKS’ Atotech to Participate in IPCA Expo 2023
09/14/2023 | MKS’ AtotechMKS’ Atotech, a leading surface finishing brand of MKS Instruments, will participate in the upcoming IPCA Expo at Bangalore International Exhibition Centre (BIEC) and showcase its latest PCB manufacturing solutions from September 13 – 15.
Comtech Unveils New BRIDGE Solutions to Increase Access to Global Hybrid Connectivity
09/12/2023 | Business WireComtech launched its new blended, resilient, integrated, digital, global, end-to-end (BRIDGE) connectivity solutions. Comtech’s BRIDGE solutions provide portable, adaptable, full-service communications networks that can be established in a matter of hours and help “bridge the gap” for traditional satellite and terrestrial infrastructures.