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iNEMI HDI Socket Warpage Prediction and Characterization Webinar

11/15/2024 | iNEMI
High-density interconnect (HDI) sockets, primarily designed for CPUs and GPUs, are shifting toward larger form factors as the number of interconnect pins increases.

AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Silicon Valley Expo & Tech Forum

11/14/2024 | AIM
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Silicon Valley Expo & Tech Forum taking place on December 5 at the Fremont Marriott Silicon Valley in Fremont, California.

North American EMS Industry Up 1.3% in December

01/29/2024 | IPC
IPC announced the December 2023 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.20.

North American PCB Industry Shipments Down 18.3% in December

01/29/2024 | IPC
IPC announced the December 2023 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 0.90.

IPC Releases December 2023 Global Sentiment of the Electronics Supply Chain Report

01/03/2024 | IPC
Electronics industry sentiment took a dip in December with New Order, Shipment, and Backlog Indices falling, with only Capacity Utilization Index holding steady.
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