Elementary, Mr. Watson: The Paradigm Shift of Silicon-to-System Design
Fresh PCB Concepts: The Journey of a PCB—A Tale of Sustainability and Circularity
Beyond Design: Integrated Circuit to PCB IntegrationINSPECTIS’ Optical BGA Inspection Now Offers Higher Magnification
December 21, 2023 | INSPECTISEstimated reading time: 1 minute
INSPECTIS’ popular BGA inspection systems can now be supplied with optional new XM lenses that offer up to 285x screen magnification, compared to the original standard lens with 200x. The INSPECTIS BGA lens package consists of a lens (standard or XM) plus a probe tip (standard or small).
The new XM higher power lens is compatible with both the Standard and the Small probe tip, which features a 27% smaller footprint.
The new XM LENSES are designated by the following part numbers:
- BGA-004-XM With standard probe tip;
- BGA-005-XM With Small probe tip.
Inspectis offers a wide range of packages/sets covering basic or advanced inspection requirements.
In making the announcement, Alistair Gooch, Marketing Manager, said, “This unique side-view BGA Inspection system features the tiniest and most robust optical probe available, with built-in high power lighting and a crisp, sharp high-resolution 90-degree viewing angle. Plus, we have recently made mechanical improvements to various aspects of the BGA camera stand, based on customer feedback that makes the platform more stable, and improves the mechanism that reduces the risk of prism damage.” The many advanced features in this system, complementing one another, make our BGA inspection system the most powerful and unique in its class, he added.
The INSPECTIS BGA Inspection System is available in 2 system levels, Basics and ProX which includes powerful INSPECTIS BGA Inspection, analysis and documentation software.
Share on:
Suggested Items
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
Cost-optimize Your PCB Design and Specifications
08/20/2024 | Erik Pedersen and Richard Koensgen, ICAPE GroupKnowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion LaboratoryCurrent trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.
Innovative and Cost-effective BGA Re-balling
07/23/2024 | Shavi Spinzi, Nano Dimension/EssemtecA new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.
Daeduck Electronics Developed Large Body FCBGA Substrate for Data Centers
06/26/2024 | BUSINESS WIREEstablished in 1965, Daeduck Electronics holds the distinction of being Korea's pioneering mass-producer of PCBs (Printed Circuit Boards), thus contributing significantly to the advancement of the nation's electronics sector for over six decades.