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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 12, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Welcome back, readers! Glad to see you. I hope you had plenty of rest over the holidays and you don’t need a vacation from your vacation. Why do Americans try to fit in so much activity during a vacation?
This week, our five must-reads include articles and news items on global fab trends and challenges, a breakdown of M&A activity in 2023, Ventec’s move into the equipment arena, the opportunities that arise from designer-fabricator communication early in the design cycle, and a new kind of AOI that’s driven by an AI neural network.
It’s been great having a few weeks of downtime, but we’re getting back to work and that feels good too. Have a good weekend!
Punching Out: 2023 PCB and EMS M&A Review
Published January 9
During 2023, we saw quite a few mergers in the PCB and EMS segments. In this column, Tom Kastner breaks down these mergers and explains some of the drivers behind them. One common theme seems to be companies outside the U.S. acquiring manufacturers to gain greater access to U.S. markets. And he sees more mergers for 2024.
Beyond Blueprints: Early Involvement Shapes Superior Fab Outcome
Published January 11
As technology advances and board features shrink, the need for communication between designers and manufacturers becomes more critical. Léa Maurel of ICAPE explains how early involvement with your fabricator can save yourself—and everyone downstream—a whole parcel of problems, from floorplanning through component placement.
Ventec International: Growth, Changes, and a New Direction
Published January 11
Suppliers often expand into a new type of product. This works best when the move feels natural and organic, complementing the company’s existing product lines. As Ventec International COO Mark Goodwin explains in this interview, the company’s recent drive into selling equipment is one such example. Every company wants to expand, but smart expansion is key.
A New Generation of AI AOI
Published January 10
Delvitech CEO Roberto Gatti looked at the AOI equipment market and realized that it was time for something completely different, as Eric Idle would say. His Swiss company entered this crowded field with an AOI system driven by an AI neural network. As he explains, “The machine learns the component, and while it learns, it already understands the best way to inspect it.” Expect to see more AI in every area of PCB manufacturing and design.
Elevating Fabrication: Investing in High-tech Equipment, Processes, and Labor
Published January 11
As chief transformation officer at Amitron, Aidan Salvi spent a good chunk of the past few years visiting fabricators in North America, Europe, and Asia. We asked Aidan to discuss what he learned in his travels. He points out that companies around the globe are ready to invest in new technologies, particularly in the highest levels of technology.
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Brent Fischthal - Koh YoungSuggested Items
Curtiss-Wright to Supply Turret Drive Stabilization Systems for U.S. Army XM30 Combat Vehicle Prototypes
10/16/2025 | BUSINESS WIRECurtiss-Wright Corporation announced that it has been selected by American Rheinmetall to provide its Turret Drive Stabilization System (TDSS) for the prototype phase of the U.S. Army’s XM30 Combat Vehicle (CV) program, which was recently approved to advance to Milestone B, the Engineering and Manufacturing Development (EMD) phase.
Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
American Standard Circuits Achieves Successful AS9100 Recertification
10/14/2025 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading manufacturer of advanced printed circuit boards, proudly announces the successful completion of its AS9100 recertification audit. This milestone reaffirms ASC’s ongoing commitment to the highest levels of quality, reliability, and process control required to serve aerospace, defense, space, and other mission-critical industries.
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.