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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
January 12, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

Welcome back, readers! Glad to see you. I hope you had plenty of rest over the holidays and you don’t need a vacation from your vacation. Why do Americans try to fit in so much activity during a vacation?
This week, our five must-reads include articles and news items on global fab trends and challenges, a breakdown of M&A activity in 2023, Ventec’s move into the equipment arena, the opportunities that arise from designer-fabricator communication early in the design cycle, and a new kind of AOI that’s driven by an AI neural network.
It’s been great having a few weeks of downtime, but we’re getting back to work and that feels good too. Have a good weekend!
Punching Out: 2023 PCB and EMS M&A Review
Published January 9
During 2023, we saw quite a few mergers in the PCB and EMS segments. In this column, Tom Kastner breaks down these mergers and explains some of the drivers behind them. One common theme seems to be companies outside the U.S. acquiring manufacturers to gain greater access to U.S. markets. And he sees more mergers for 2024.
Beyond Blueprints: Early Involvement Shapes Superior Fab Outcome
Published January 11
As technology advances and board features shrink, the need for communication between designers and manufacturers becomes more critical. Léa Maurel of ICAPE explains how early involvement with your fabricator can save yourself—and everyone downstream—a whole parcel of problems, from floorplanning through component placement.
Ventec International: Growth, Changes, and a New Direction
Published January 11
Suppliers often expand into a new type of product. This works best when the move feels natural and organic, complementing the company’s existing product lines. As Ventec International COO Mark Goodwin explains in this interview, the company’s recent drive into selling equipment is one such example. Every company wants to expand, but smart expansion is key.
A New Generation of AI AOI
Published January 10
Delvitech CEO Roberto Gatti looked at the AOI equipment market and realized that it was time for something completely different, as Eric Idle would say. His Swiss company entered this crowded field with an AOI system driven by an AI neural network. As he explains, “The machine learns the component, and while it learns, it already understands the best way to inspect it.” Expect to see more AI in every area of PCB manufacturing and design.
Elevating Fabrication: Investing in High-tech Equipment, Processes, and Labor
Published January 11
As chief transformation officer at Amitron, Aidan Salvi spent a good chunk of the past few years visiting fabricators in North America, Europe, and Asia. We asked Aidan to discuss what he learned in his travels. He points out that companies around the globe are ready to invest in new technologies, particularly in the highest levels of technology.
Suggested Items
Collins Aerospace Approved to Begin Full Rate Production of MAPS Gen II system
03/13/2025 | Collins AerospaceCollins Aerospace, an RTX business, has received approval for Full Rate Production of the Mounted Assured Positioning, Navigation and Timing (PNT) Generation II system (MAPS GEN II).
Eltek Reports Full Year and Q4 2024 Financial Results
03/13/2025 | EltekEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), today announced its financial results for the full year and fourth quarter ended December 31, 2024.
YINCAE: UF 158UL Redefines Underfill for Large Chips
03/12/2025 | YINCAEYINCAE, a leading innovator in advanced materials solutions, today announced the launch of its groundbreaking underfill material, UF 158UL. This cutting-edge product is designed to meet the increasing demands of large format chips, offering unparalleled performance in room temperature flow, fast cure, and high reliability.
MicroCraft to Unveil Three New Models at IPC APEX EXPO 2025
03/12/2025 | MicroCraftMicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.
Pudu Robotics' PUDU T300 Achieves CE-MD and CE-RED Certifications
03/12/2025 | PRNewswirePudu Robotics, a global leader in service robotics sector, announced its innovative industrial delivery robot, the PUDU T300, has obtained both the CE-MD (Machinery Directive) and CE-RED (Radio Equipment Directive) certificates by TÜV SÜD, a world-renowned testing and certification organization.