Beyond Design: The Metamorphosis of the PCB Router
Global PCB Connections: Embedded Components—The Future of High-performance PCB Design
Elementary, Mr. Watson: PCB Routing: The Art—and Science—of Connection
ITW EAE Patented Auto Exit Wing Feature for Electrovert Wave Soldering Machines
January 16, 2024 | ITW EAEEstimated reading time: 1 minute
ITW EAE’s patented feature for the Electrovert Wave Soldering machines that provides automatic adjustment of the laminar wave flow to match the board velocity. To fully optimize the flow dynamics of the laminar wave, the velocity of the PCB needs to equal the flow of the solder over the weir of the exit wing. When the wave flow is fully optimized, the PCB ‘peels’ away from the solder which minimizes the opportunity for bridging defects to occur.
Electrovert’s Auto Exit Wing provides highly repeatable, precisely controlled exit wing adjustment that has been proven to deliver up to a 70% reduction in bridging defects and improved topside hole fill,” said Greg Calvo, ITW EAE Wave Soldering Business Manager. “Adjustments are made on-the-fly, eliminating the need for skilled labor to adjust the exit wing manually during product changeover.”
The Auto Exit Wing is activated by a recipe-controlled set-point to ensure optimal wave dynamics for every PCB type and application. Electrovert has built a high level of control and rapid change capability within the wave soldering process which provides great flexibility for lot-size-of-one capability in high-mix soldering applications. The system captures all data required for MES integration.
The Auto Exit Wing feature is fully compatible with all Electrovert UltraFill 4.0 and DwellMax 4.0 nozzles in both Air and N2 Tunnel environments and is field upgradeable.
Share on:
Suggested Items
American Standard Circuits to Exhibit at IMS 2025
06/12/2025 | American Standard CircuitsAnaya Vardya, President and CEO of American Standard Circuits & ASC Sunstone Circuits, announced that his companies will exhibit at the IEEE International Microwave Symposium (IMS 2025), taking place June 15-20, 2025, at San Francisco’s Moscone Center.
Quantic X-Microwave Collaborates with Nuvotronics
06/11/2025 | PRNewswireQuantic X-Microwave, a business of Quantic Electronics and leading provider of modular RF and microwave solutions, announced a new collaboration with Nuvotronics, a business of Cubic and leader in innovative microwave and millimeter-wave solutions.
Qualcomm to Acquire Alphawave Semi
06/09/2025 | BUSINESS WIREQualcomm Incorporated announced that it has reached an agreement with Alphawave IP Group plc (AWE.L) (Alphawave Semi) regarding the terms and conditions of a recommended acquisition by Aqua Acquisition Sub LLC, an indirect wholly-owned subsidiary of Qualcomm Incorporated, for the entire issued and to be issued ordinary share capital of Alphawave Semi at an implied enterprise value of approximately US$2.4 billion.
Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment
05/30/2025 | MicrosemblyMicrosembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.
Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
05/29/2025 | Amphenol Printed CircuitsAmphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.