Elementary Mr. Watson: Running the Signal Gauntlet
The Shaughnessy Report: Winning the Signal Integrity Battle
Connect the Dots: How to Avoid Five Common Causes of Board Failure
High Density Packaging User Group Announces Gold Circuit Electronics Membership
February 6, 2024 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging User Group (HDP) is pleased to announce that Gold Circuit Electronics (GCE) has become a member.
"GCE is a top 25 printed circuit board manufacturer with top Fortune 100 OEM customers in the server, AI, data center, cloud, storage, switch, router, base station, telecom, automotive, industrial and medical markets supply. Our tech range has grown significantly in the last 5+ years to include a large percentage of business in the advanced tech space", said Joseph Beers, Senior Vice President at GCE. “Joining HDPUG is a strategic decision to increase our presence in this community and contribute, learn, and collaborate meaningfully to help our business alignment in the markets and with the customers we serve.”
"I am pleased to welcome GCE to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in PWB fabrication for high performance electronics, especially those focused on next-generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
High Density Packaging User Group Announces Dynamic Electronics Membership
10/14/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Dynamic Electronics Co., Ltd. (Dynamic) has become a member.
Real Time with… IPC APEX EXPO 2024: The HDP User Group's Role in the Electronics Industry
05/22/2024 | Real Time with...IPC APEX EXPOBev Christian, a project facilitator from the HDP User Group, outlines the consortium's focus on new materials and reliability in the electronics industry, and their collaboration on non-proprietary projects. Key areas of interest include corrosion, PFAS, and lead-free solders. Bev also highlights the value of collaboration and mentions partnerships with other consortia. The HDP User Group welcomes interested individuals to get involved via their website.
High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
05/20/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.
High Density Packaging User Group Announces Shikoku Chemicals Corporation Membership
02/02/2024 | HDP User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shikoku Chemicals Corporation (Shikoku) has become a member.