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High Density Packaging User Group Announces Gold Circuit Electronics Membership
February 6, 2024 | HDP User GroupEstimated reading time: Less than a minute
High Density Packaging User Group (HDP) is pleased to announce that Gold Circuit Electronics (GCE) has become a member.
"GCE is a top 25 printed circuit board manufacturer with top Fortune 100 OEM customers in the server, AI, data center, cloud, storage, switch, router, base station, telecom, automotive, industrial and medical markets supply. Our tech range has grown significantly in the last 5+ years to include a large percentage of business in the advanced tech space", said Joseph Beers, Senior Vice President at GCE. “Joining HDPUG is a strategic decision to increase our presence in this community and contribute, learn, and collaborate meaningfully to help our business alignment in the markets and with the customers we serve.”
"I am pleased to welcome GCE to HDP, joining the outstanding companies working on HDP User Group projects. Their expertise and capability in PWB fabrication for high performance electronics, especially those focused on next-generation servers and networking products, will contribute significantly to several of our emerging technology projects", said Larry Marcanti, Executive Director of HDP User Group.
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05/22/2024 | Real Time with...IPC APEX EXPOBev Christian, a project facilitator from the HDP User Group, outlines the consortium's focus on new materials and reliability in the electronics industry, and their collaboration on non-proprietary projects. Key areas of interest include corrosion, PFAS, and lead-free solders. Bev also highlights the value of collaboration and mentions partnerships with other consortia. The HDP User Group welcomes interested individuals to get involved via their website.
High Density Packaging User Group Announces Shenzhen Kinwong Electronic Co., Ltd. Membership
05/20/2024 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Shenzhen Kinwong Electronic Co., Ltd. (Kinwong) has become a member.
High Density Packaging User Group Announces Shikoku Chemicals Corporation Membership
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HDPUG: 30 Years of Collaboration
01/01/2024 | Madan Jagernauth, Marketing Directory HDPThe High Density Packaging User Group International Inc. (HDP) and IPC have partnered successfully for many years. The groups signed an MOU in 2020 to strengthen this relationship, increase technical collaboration between the groups, and provide a mutual path toward emerging and disruptive high-density interconnect (HDI) technologies. IPC became a member of HDP at that point.
High Density Packaging User Group Announces Uyemura Membership
10/18/2021 | HDP User GroupHigh Density Packaging (HDP) User Group is pleased to announce that Uyemura International (Uyemura) has become a member.