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Uyemura Boosts Field and Met Lab Teams
February 21, 2024 | UyemuraEstimated reading time: Less than a minute
![](https://iconnect007.com/application/files/3717/0854/2167/russ-schwartz_uyemura.jpg)
Uyemura has announced an important field promotion, and a new addition to its Connecticut Tech Center Engineering Team. Both actions are in support of the company’s increasing focus on IC substrates, and its role as a supplier to wafer manufacturers, semiconductor fabs and PWB customers.
Russ Schwartz, a Uyemura Senior Mechanical Engineer with 20+ years experience, has been promoted to Project Engineer. Prior to joining Uyemura, Schwartz worked in every stage of wafer fabrication during tenures at Intel and Motorola. In his new position, he will qualify and maintain process lines, assure chemistry performance, and provide mechanical expertise for the design and installation of Uyemura equipment.
Steve Medd is also a veteran of the semiconductor industry, with 15 years experience. At IBM and Entegris, he held posts in applications engineering and process engineering, respectively. In his new position as Uyemura Support Engineer, he provides customer support at the Tech Center metallurgical lab.
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I-Connect007 Columnist George Milad Passes Away
12/20/2023 | I-Connect007 Editorial TeamI-Connect007 columnist George Milad passed away on Dec. 7, 2023, at the age of 81. George was well-known in the PCB industry for his technical expertise in physical organic chemistry. He was employed as a national accounts manager at Uyemura International Corporation, was the author of the chapters on plating and surface finishing in Printed Circuit Handbook: Seventh Edition, and had a series of publications on electrolytic plating and metallic surface finishes.
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