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Uyemura Boosts Field and Met Lab Teams
February 21, 2024 | UyemuraEstimated reading time: Less than a minute
Uyemura has announced an important field promotion, and a new addition to its Connecticut Tech Center Engineering Team. Both actions are in support of the company’s increasing focus on IC substrates, and its role as a supplier to wafer manufacturers, semiconductor fabs and PWB customers.
Russ Schwartz, a Uyemura Senior Mechanical Engineer with 20+ years experience, has been promoted to Project Engineer. Prior to joining Uyemura, Schwartz worked in every stage of wafer fabrication during tenures at Intel and Motorola. In his new position, he will qualify and maintain process lines, assure chemistry performance, and provide mechanical expertise for the design and installation of Uyemura equipment.
Steve Medd is also a veteran of the semiconductor industry, with 15 years experience. At IBM and Entegris, he held posts in applications engineering and process engineering, respectively. In his new position as Uyemura Support Engineer, he provides customer support at the Tech Center metallurgical lab.
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Real Time with... IPC APEX EXPO 2024: Final Finishes and IC Substrate Manufacturing
04/24/2024 | Real Time with...IPC APEX EXPOEditor Marcy LaRont and Richard DePoto, Uyemura's Business Development Manager, engage in a comprehensive discussion about the positive aspects of the show, the benefits of RAIG in final finishes, and the hurdles faced when upgrading your surface finish. Also discussed are the role of Uyemura's MEC pretreatment agents in IC substrate manufacturing and the importance of collaboration and knowledge sharing.
Uyemura Expands Technical Service Capacity in the Northeast
01/09/2024 | UyemuraKatarina Roy has been appointed Technical Service Engineer, expanding Uyemura’s technical resources in the US northeast and the province of Ontario. She will work from Andover, MA. and the Uyemura Tech Center in Southington, CT.
I-Connect007 Columnist George Milad Passes Away
12/20/2023 | I-Connect007 Editorial TeamI-Connect007 columnist George Milad passed away on Dec. 7, 2023, at the age of 81. George was well-known in the PCB industry for his technical expertise in physical organic chemistry. He was employed as a national accounts manager at Uyemura International Corporation, was the author of the chapters on plating and surface finishing in Printed Circuit Handbook: Seventh Edition, and had a series of publications on electrolytic plating and metallic surface finishes.
Uyemura Expands Senior Leadership Team
12/15/2021 | UyemuraUyemura, a world leader in specialty surface technologies, has announced a landmark expansion of its senior leadership team.
High Density Packaging User Group Announces Uyemura Membership
10/18/2021 | HDP User GroupHigh Density Packaging (HDP) User Group is pleased to announce that Uyemura International (Uyemura) has become a member.