-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLearning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Training New Designers
Where will we find the next generation of PCB designers and design engineers? Once we locate them, how will we train and educate them? What will PCB designers of the future need to master to deal with tomorrow’s technology?
The Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
The World of Electronics and Standards: A Conversation with Frank Honyotski, STI
April 3, 2024 | Marcy LaRont, PCB007 MagazineEstimated reading time: Less than a minute
Marcy LaRont of I-Connect007 speaks with Frank Honyotski of STI Electronics, who discusses the services offered by STI, including training, engineering, and failure analysis. He highlights his involvement with IPC standards development and emphasizes the importance of industry professionals engaging in standards development.
Suggested Items
“Let’s Talk Production Test” with Bert Horner of The Test Connection, Inc. at SMTA Long Island Meeting
04/02/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is pleased to announce that its President, Bert Horner, will present at the SMTA Long Island Chapter Technical Meeting & Dinner on Wednesday, April 16, 2025. The event will take place at the Radisson Hotel Hauppauge in Hauppauge, NY.
Uyemura Announces Six Sigma Graduates
04/02/2025 | UyemuraDr. Patrick Valentine, Technical & Lean Six Sigma Manager and Six Sigma Master Black Belt, announces the completion of Lean Six Sigma Black Belt training by 4 members of Uyemura’s professional staff.
Teradyne Announces Production System for Double-Sided Wafer Probe Test for Silicon Photonics
04/02/2025 | TeradyneTeradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the first high-volume, double-sided wafer probe test cell for silicon photonics.
TRI Test Solutions at INNOELECTRO 2025
04/02/2025 | TRIAnytest will join INNOELECTRO 2025, held at BOK Sportcsarnok from April 8 – 10, 2025, to showcase TRI's Test Solution.
Real Time with... IPC APEX EXPO 2025: Revitalizing the U.S. Microelectronics Industry with PCBAA
04/01/2025 | Real Time with...IPC APEX EXPOPCBAA president David Schild discusses his experience in the PCB and aerospace sectors, focusing on the mission of the PCBAA and its collaboration with IPC. He highlights the decline in PCB manufacturing in the U.S. and the importance of public policy in restoring capacity.