-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueProduction Software Integration
EMS companies need advanced software systems to thrive and compete. But these systems require significant effort to integrate and deploy. What is the reality, and how can we make it easier for everyone?
Spotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Empowering Electronics Assembly: Introducing ALPHA Innolot MXE Alloy
April 16, 2024 | MacDermid Alpha Electronics SolutionsEstimated reading time: 2 minutes

In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. Today, we are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. “As an industry partner, we understand the importance of staying at the forefront of market trends. With Innolot MXE, we provide a groundbreaking solution that supports the highest standards of quality and performance” said Ebad Rehman, Product Manager, Solder Paste in the Americas, and Europe.
Advancing Performance with Innolot MXE
Innolot MXE represents a significant breakthrough in reliability, offering enhanced thermomechanical performance to meet the increasing rigorous demands of electronic assemblies. Surpassing traditional options like SAC305 and other high-reliability alternatives, Innolot MXE delivers exceptional thermal cycling, vibration, and drop shock performance. In addition, it achieves high creep-fatigue resistance, through a refined microstructure, making it ideal for the most demanding ruggedized applications. With its unparalleled combination of features, Innolot MXE is ready to usher in the next generation of excellence in electronic assembly.
Driven by Industry Demands
The development of Innolot MXE was inspired by the complex challenges present in sectors spanning automotive, aerospace, high-end computing, and industrial applications, where reliability is critical. Environments with severe stress on solder joints underscore the need for Innolot MXE, as traditional alloy options are limited in performance and durability. This innovative solution offers a higher margin of performance to enhance in-use life and advance board level reliability.
- Innolot MXE addresses new challenges in safety-critical systems, miniaturization, and harsh operating environments, setting a new standard for performance.
- Enhanced Creep Fatigue toughness inhibits crack propagation and improves thermal cycling performance as compared to SAC305 and other high-reliability alloys.
Innolot MXE is Available in ALPHA CVP-390V Solder Paste
To complement its exceptional thermomechanical performance, Innolot MXE is now available in combination with ALPHA CVP-390V solder flux. This offering presents an unparalleled blend of high-performance alloy and solder paste chemistry, ensuring unmatched electrochemical reliability even in the most demanding scenarios.
- ALPHA CVP-390V solder flux provides superior Surface Insulation Resistance (SIR) performance, ensuring reliability in complex assemblies and optimal process capability index (CpK) transfer efficiency, across varying print volumes and area ratios.
Experience ALPHA Innolot MXE, where reliability and performance come together to drive the future of innovation.
Check out these new eBooks from MacDermid Alpha Electronic Solutions:
- The Printed Circuit Assembler's Guide to... ™ Low-temperature Soldering, Vol. 2
- The Printed Circuit Assembler's Guide to... ™ Encapsulating Sustainability for Electronics
For more educational titles, visit the I-007eBooks library.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
Now Available—The Companion Guide to… SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages
10/03/2025 | I-Connect007I-Connect007 is pleased to announce the release of an 18-page resource for engineers, technologists, and decision-makers in electronics manufacturing: The Companion Guide to SMT Inspection: Today, Tomorrow, and Beyond: Mastering Metrology for Advanced Semiconductor Packages.
Target Condition: Rethinking the PCB Stackup Recipe
10/01/2025 | Kelly Dack -- Column: Target ConditionMarie Antoinette is attributed with saying, “Let them eat cake,” but historians now agree she likely never said it. It was probably revolutionary propaganda to paint her as out of touch with the starving masses. Yet, the phrase still lingers, and oddly enough, it applies to the world of PCB design.
Empower Sets New Benchmark with 20x Faster Response and Breakthrough Sustainability Demonstrated at OCP Global Summit 2025
09/25/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in powering AI-class processors, announced that its Crescendo chipset, an artificial intelligence (AI) and high-performance computing (HPC) processor true vertical power delivery platform, is available now for final sampling, with mass production slated for late 2025.