Beyond Design: AI-driven Inverse Stackup Optimization
Global PCB Connections: Following DFM Rules Leads to Better Boards
Elementary Mr. Watson: How to Reinvent Your Professional Journey
Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
May 16, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: 1 minute
You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine, our annual review of everything that happened during our week in Anaheim, California.
“A special thank you to the IPC team for organizing such a powerful event,” says Barry Matties, publisher of I-Connect007. The Technical Conference was world-class, and the well-thought-out Professional Development Courses are helping many to grow in their careers. The Emerging Engineer program is growing and helping our industry become better.”
What will you find inside this issue?
- Show reviews from industry professionals who traversed the show floor, attended conference sessions, and helped to connect all the pieces that this show offers.
- A view through a photographer's lens in our many photo galleries, capturing the show floor, keynote speakers, receptions, and of course, the guests.
- Nearly 100 video interviews with industry leaders who share topics of interest, including the latest innovations and product releases from their companies.
- Interviews with many of the recipients of IPC’s annual awards, including Hall of Fame, Dieter Bergman Fellowship Award, President’s Award, Rising Star, Best Technical Paper, Best Student Poster, and committee volunteers.
- Reviews of the three keynote speakers, winners of the IPC Design Competition, a review of Factory of the Future/CFX, and standards activity.
“In the end, it took many hands to make light work,” Matties says. “So, a big thank you to all who worked to make this show valuable to the industry and help us build electronics better.”
Click here to see what's inside!
Download a pdf copy.
Like what you see? Share the issue with your connections on LinkedIn by copying and posting this link.
Share on:
Suggested Items
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2
12/23/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/20/2024 | Nolan Johnson, I-Connect007Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Offshore Sourcing in the Global Supply Chain
11/20/2024 | Brittany Martin, I-Connect007Bob Duke, president of the Global Sourcing Division at American Standard Circuits, discusses the challenges and benefits of navigating the global supply chain, including the value of strong supplier relationships, rigorous quality control, and strategic sourcing from regions including China, Vietnam, and India.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.