-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Relive the Experience: Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine
May 16, 2024 | Real Time with...IPC APEX EXPOEstimated reading time: 1 minute

You came, you saw, and you experienced the magic of IPC APEX EXPO 2024. Now you get to relive the many memories and experiences in the pages of Real Time with… IPC APEX EXPO 2024 Show & Tell Magazine, our annual review of everything that happened during our week in Anaheim, California.
“A special thank you to the IPC team for organizing such a powerful event,” says Barry Matties, publisher of I-Connect007. The Technical Conference was world-class, and the well-thought-out Professional Development Courses are helping many to grow in their careers. The Emerging Engineer program is growing and helping our industry become better.”
What will you find inside this issue?
- Show reviews from industry professionals who traversed the show floor, attended conference sessions, and helped to connect all the pieces that this show offers.
- A view through a photographer's lens in our many photo galleries, capturing the show floor, keynote speakers, receptions, and of course, the guests.
- Nearly 100 video interviews with industry leaders who share topics of interest, including the latest innovations and product releases from their companies.
- Interviews with many of the recipients of IPC’s annual awards, including Hall of Fame, Dieter Bergman Fellowship Award, President’s Award, Rising Star, Best Technical Paper, Best Student Poster, and committee volunteers.
- Reviews of the three keynote speakers, winners of the IPC Design Competition, a review of Factory of the Future/CFX, and standards activity.
“In the end, it took many hands to make light work,” Matties says. “So, a big thank you to all who worked to make this show valuable to the industry and help us build electronics better.”
Click here to see what's inside!
Download a pdf copy.
Like what you see? Share the issue with your connections on LinkedIn by copying and posting this link.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/20/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON India
08/14/2025 | Koh YoungKoh Young, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications in Hall 1 Booth 1086 during SEMICON India 2025 held September 2-4, 2025, at Yashobhoomi (IICC), New Delhi, India.
Nordson Electronics Solutions Develops Panel-level Packaging Solution for Powertech Technology
06/17/2025 | Nordson Electronics SolutionsNordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, has developed several solutions for panel-level packaging (PLP) during semiconductor manufacturing. In one particular case,