-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Book Excerpt: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics
June 12, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, by Beth Turner, MacDermid Alpha Electronics Solutions
Chapter 1: What Are Encapsulation Resins, and Why Do We Use Them?
The terms potting and encapsulation resins are interchangeable. The terms are interpreted slightly differently depending on the industry or organization. Potting sometimes refers to the process of filling housing; the housing forms an integral part of the finished component. The container sometimes functions as a temporary mold to contain the liquid until sufficiently gelled or cured. Then it is removed from the finished assembly. A container or pot is not always required. The rheology of some materials means selective application is possible; this is often referred to as “glob top” application. Some organizations use the word potting to describe the liquid material, and encapsulation to describe the application process and subsequent cure conditions to form the end ruggedizing material.
The end goal of encapsulation is to form a complete, thick barrier, ensuring that printed circuit boards (PCBs) and other electronic components are sufficiently “encapsulated” to survive in the harshest conditions. The primary function is the barrier property: preventing moisture and other contaminants causing current leakage and short circuits, inhibiting corrosion, preventing arcing and corona in high voltage applications, and mitigating against tin whiskers. They can also deliver other secondary value-added functions: mechanically supporting to prevent damage from shock and vibration, delivering flame retardant properties, and dissipating heat away from hard-working components.
Suggested Items
BOOK EXCERPT: The Printed Circuit Assembler’s Guide to... Encapsulating Sustainability for Electronics, Chapter 3
07/24/2024 | I-Connect007 Editorial TeamThis chapter provides an in-depth analysis of general-purpose and specialist encapsulation resins for electronic applications. Also covered are properties, testing methods, suitability for harsh environments, and thermal management of high-power density electronic devices.
MacDermid Alpha Electronics Solutions’ New Book Now Available for Download
03/29/2024 | I-Connect007I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting.
Heraeus Electronics, Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology
05/24/2023 | Heraeus ElectronicsHeraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany.
Sensible Design: Let’s Take Down the Heat on Resins
05/04/2022 | Team Electrolube -- Column: Sensible DesignElectrolube’s Senior Technical Manager Beth Turner picks up the thread of her previous columns to describe where resins are currently playing a vital role in the modern world, while also offering an insight into their thermal conductivity, suitability for RF applications, and exploring a new era of bio-based encapsulation resins that not only improve the environment at large, but also end-use reliability and increased consumer satisfaction.
Sensible Design: The Rise of Resins in IoT Applications
01/05/2022 | Team Electrolube -- Column: Sensible DesignThe Internet of Things (IoT) is a platform enabling embedded devices connected to the internet, to collect and exchange data with each other. Devices can begin to interact and work with each other, even learning from each other’s experience as humans do. The potential for the IoT and connectivity is endless, as everyday objects can connect and share intelligence and knowledge. What role do resins play?