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MacDermid Alpha Electronics Solutions’ New Book Now Available for Download

03/29/2024 | I-Connect007
I-Connect007 is pleased to announce the launch of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics by Beth Turner at MAES. The latest in a series of educational books published by I-Connect007, this book is an introductory guide to understanding encapsulation resins and a tool for application troubleshooting. 

Heraeus Electronics, Bosch Sign Patent and Know-How License Agreement for Inorganic Potting Technology

05/24/2023 | Heraeus Electronics
Heraeus Electronics and Robert Bosch GmbH have signed a patent and know-how license agreement at the PCIM Europe exhibition in Nuremberg, Germany.

Sensible Design: Let’s Take Down the Heat on Resins

05/04/2022 | Team Electrolube -- Column: Sensible Design
Electrolube’s Senior Technical Manager Beth Turner picks up the thread of her previous columns to describe where resins are currently playing a vital role in the modern world, while also offering an insight into their thermal conductivity, suitability for RF applications, and exploring a new era of bio-based encapsulation resins that not only improve the environment at large, but also end-use reliability and increased consumer satisfaction.

Sensible Design: The Rise of Resins in IoT Applications

01/05/2022 | Team Electrolube -- Column: Sensible Design
The Internet of Things (IoT) is a platform enabling embedded devices connected to the internet, to collect and exchange data with each other. Devices can begin to interact and work with each other, even learning from each other’s experience as humans do. The potential for the IoT and connectivity is endless, as everyday objects can connect and share intelligence and knowledge. What role do resins play?

Soldering and Joint Encapsulation with One Step Reflow from SHENMAO

08/25/2021 | SHENMAO America, Inc.
SHENMAO America, Inc.’s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively.
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