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MacDermid Alpha Introduces Reworkable Edgebond for High-Reliability Electronics

02/06/2025 | MacDermid Alpha Electronics Solutions
In an era where high-performance and sustainable manufacturing practices are crucial, MacDermid Alpha Electronics Solutions is redefining industry standards with the launch of ALPHA® HiTech® CF31-4026.

Teledyne Completes Acquisition of Select Aerospace and Defense Electronics Businesses of Excelitas

02/05/2025 | BUSINESS WIRE
Teledyne Technologies Incorporated announced today the successful completion of the acquisition of select aerospace and defense electronics businesses from Excelitas Technologies Corp. (“Excelitas”) for approximately $710 million. The acquisition includes the optical systems business known under the Qioptiq® brand based in Northern Wales, UK, as well as the U.S.-based advanced electronic systems business.

Indium Expert to Address Thermal Challenges at TestConX 2025

02/04/2025 | Indium Corporation
Indium Corporation Technical Support Engineer Carson Burt will deliver a technical presentation at TestConX 2025, taking place March 3-5 in Mesa, Arizona.

TopLine Bringing Answers, New Ideas to APEX 2025

02/04/2025 | TopLine
TopLine® Corporation’s engineers will discuss groundbreaking technologies and product solutions at the upcoming IPC APEX EXPO 2025 this coming March 18-20 at the Anaheim Convention Center in California.

YINCAE Launches UF 120LA

02/04/2025 | YINCAE
YINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
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