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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 14, 2024 | Nolan Johnson, PCB007Estimated reading time: 2 minutes

This week’s must-reads are comprised of news which moves the industry forward. We’ve had quite a lot of news on a global scale, and they’re all good reads. To winnow down to just five, I chose either new information or interesting takes on ongoing industry stories. To that end, we have news about new capital equipment for advanced packaging, discussions of material selection and the imaging process during PCB fabrication, a columnist's ode to the best engineer she knows, and some optimistic news from the semiconductor industry.
ASMPT Combines High-speed Chip Assembly Directly from the Wafer with SMT Placement in a Single Machine
Published June 6
System in package (SiP) technology is not just a thing of the future. It’s here today and ASMPT has announced manufacturing equipment to support SiP. This new system “processes both SMDs from tapes and dies taken directly from the wafer in a single step at speeds of up to 50,000 dies or 76,000 SMT components per hour.” It might not become a mainstream manufacturing method in 2024, but it’s clear packages will be bypassed entirely for certain silicon die in the near future.
Overconstrain? Underconstrain? Selecting Materials for High-speed Designs
Published June 6
No matter the technical sophistication of your PCB design, the evolution of state-of-the-art packages continues to make materials selection a critical step in the design process. So, I-Connect007’s Andy Shaughnessy asked Stephen Chavez, principal technical product marketing manager at Siemens, to share his thoughts on material selection for high-speed designs. Steph discusses material constraints, stackups, and the cut-off point when a “traditional” laminate will (and won’t) work for a high-speed board.
ASC Sunstone Talks Imaging in Latest Podcast Episode
Published June 11
In the latest episode of the podcast series, On the Line With: Designing for Reality, I returned to Sunstone Circuits in Mulino, Oregon, to continue down the manufacturing process with Matt Stevenson.
This series is all about the specifics that can affect your circuit board during the manufacturing process and includes tips and tricks for optimizing design, fabrication, yields, and cost. In this episode, Matt paints a picture of the outer layer imaging process. Since each circuit board is a one-of-a-kind pattern of metal connections representing the specific design for that circuit, how do those unique features get mapped onto the board? Find out in Episode 7.
Global Semiconductor Sales Increase 15.8% YoY in April
Published June 7
This announcement from the Semiconductor Industry Association (SIA) was interesting enough to make my must-reads based on the numbers alone. But at the risk of spoiling the article, I found this passage most interesting: “SIA today endorsed the WSTS (World Semiconductor Trade Statistics organization) Spring 2024 global semiconductor sales forecast, which projects annual global sales will grow to $611.2 billion in 2024, which would be the industry’s highest-ever annual sales total.” Get all the numbers here.
The New Chapter: Lessons From the Best Engineer I’ve Ever Known
Published June 12
How did you get into this industry? Did you follow in a family member’s footsteps? As columnist Paige Fiet explains, her engineer father played a large part in her decision to become an engineer. In this column, Paige discusses the lessons she’s learned from her father—engineering and otherwise—that have shaped the way she looks at her job and the world.
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Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.