-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSilicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
Cost Drivers
In this month’s issue of Design007 Magazine, our expert contributors explain the impact of cost drivers on PCB designs and the need to consider a design budget. They discuss the myriad design cycle cost adders—hidden and not so hidden—and ways to add value.
Mechatronics
Our expert contributors discuss the advent of mechatronics in PCB design, the challenges and opportunities this creates for circuit board designers, and the benefits—to the employee and the company—of becoming a mechatronics engineer.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
Winners of 2024 IPC Masters Competition China Announced
July 17, 2024 | IPCEstimated reading time: 2 minutes
![](https://iconnect007.com/application/files/6417/2121/7368/Winners2024IPC.jpg)
From July 8-10, the 2024 IPC Masters Competition China was successfully held in Pudong, Shanghai. This year’s competition, was the largest in the history of the Greater China region, bringing nearly 400 electronics industry elites from 18 provinces and municipalities. The event covered diverse industry sectors, including aerospace, automotive electronics, rail transit, consumer electronics, energy, and industrial manufacturing.
A total of 154 contestants advanced to the practical competition after passing the Standards Knowledge Competition. Among them, 108 competed in the Hand Soldering and Rework Competition (HSRC), 30 in the Cable and Wire Harness Assembly Competition (CWAC), and 16 in the Ball Grid Array/Bottom Termination Components Rework Competition (BGA/BTC).
Winners of HSRC were:
- First Place: Dahai Hu, The 10th Institute of China Electrics Technology Group Corporation
- Second Place: Zhiheng Zhou, Jiangsu Jinling Mechanism Manufacture Factory
- Third Place: Huanhuan Bo, JARI Electronics Co., Ltd.
Winners of CWAC were:
- First Place: Jie Lu, Beijing Wireless Measuring Research Laboratory
- Second Place: Ping Wang, Avic Lanzhou Wanli Aviation Electromechanical Co., Ltd.
- Third Place: Jiao Hao, Shijiazhuang Haishan Industrial Development Corporation
Winners of BGA/BTC were:
- First Place: Xuyuan Deng, Jiangsu Jinling Mechanism Manufacture Factory
- Second Place: Kaiyuan Li, Avic Xi'an Flight Automatic Control Research Institute
- Third Place: Xiaoquan Zhu, Wistron InfoComm (Zhongshan) Corp.
Dahai Hu, the champion of the Hand Soldering and Rework Competition, expressed, "Participating in the IPC Masters was a great opportunity. Through this competition, I integrated theoretical knowledge with practical experience and deepened my understanding of IPC standards. I am grateful to the IPC staff for providing this professional platform and I appreciate my mentors’ guidance and training. I will now fully prepare for the global finals and strive to achieve an outstanding result."
The IPC Masters Competition China also promoted the dissemination of quality and technical standards within the industry. Sydney Xiao, president of IPC APAC, stated, "The advancement of the industry cannot be separated from the development and promotion of standards. IPC has always been committed to enhancing the standardization and internationalization of the electronics manufacturing industry. Currently, more than 580 experts from over 300 Chinese enterprises are involved in the development of IPC standards. We hope to further promote IPC's advanced technical standards through a professional and challenging platform and to inspire more people to improve their skills, deeply understand, and effectively practice IPC standards, thereby jointly promoting high-quality and high-level development of the electronics manufacturing industry."
IPC would like to thank 2024 IPC Masters Competition China sponsors and partners for their generous support this year.
- Premier Sponsor: Quick Intelligent Equipment Co., Ltd.
- Supporting Sponsors: Shanghai POUSTO Electronic Engineering Co., Ltd; DONGGUAN WEITAI ELECTRONICS CO., LTD; Shanghai United Silicon Technology Co., Ltd; ZESTRON Asia Pacific North Asia Branch
- Co-Organizer: Pudong New Area Association For Quality And Technology Shanghai
- Strategic Partner: Messe Muenchen Shanghai Co., Ltd.
Suggested Items
Hon Hai, Extreme Tech Challenge Join Hands to Host Semi and AI Climate Innovation Competition
07/30/2024 | Hon Hai Technology GroupHon Hai Technology Group, the world’s largest electronics manufacturing and service provider, and Extreme Tech Challenge (XTC), the world’s largest innovation ecosystem, today announced a partnership to jointly promote the Semiconductor (Semi) and Artificial Intelligence (AI) Climate Innovation Competition.
Winners of the IPC Hand Soldering and Rework Competition Malaysia at Electronics Manufacturing Expo Asia (EMAX) 2024 Announced
07/29/2024 | IPCIn conjunction with Electronics Manufacturing Expo Asia (EMAX) 2024, IPC hosted its popular IPC Hand Soldering and Rework Competition in Penang, Malaysia July 24-26, 2024. The competition welcomed 36 contestants from 14 well-known electronics companies, and one institution in Malaysia.
OE-A Competition 2025 – Calling Innovators in Printed Electronics
07/10/2024 | OE-AThe goal of the OE-A Competition is to promote and highlight innovations that drive the international market for organic and printed electronics forward.
Winners of IPC Hand Soldering and Rework Competition at NEPCON Thailand 2024 Announced
07/05/2024 | IPCIn conjunction with NEPCON Thailand 2023, IPC hosted its popular IPC Hand Soldering and Rework Competition in Bangkok, on June 19-22, 2024. The seventh edition of the competition in Thailand welcomed 40 participants from 14 companies.
IPC Masters 2024 Aims to Enhance Operator Skills in China
06/14/2024 | IPCTo meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event called IPC Masters 2024 in Shanghai, China.