Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Real Time with... THECA 2024: IPC Focusing on the Needs of a Growing Region
July 31, 2024 | Real Time with... THECAEstimated reading time: Less than a minute
Dave Bergman, vice president of standards and technology at IPC, updates Nolan Johnson on the active development work underway by IPC in the SE Asia region. Dave shares that IPC is very involved in helping to encourage and enable new investment in this region through IPC's core work in standards, education, and advocacy. Watch the interview now.
For our full coverage of THECA 2024, visit the Real Time with... THECA 2024 site.
Share on:
Suggested Items
The Government Circuit: From Tax Policy to Tariffs, Denver to Delhi, Speaking Up for Electronics
06/18/2025 | Chris Mitchell -- Column: The Government CircuitI had the privilege of attending the June 3 opening ceremony of AT&S’s HTB3 facility in Leoben, Austria—a milestone moment for Europe’s electronics ecosystem. HTB3 is now the first and only facility in Europe capable of both developing and producing high-performance IC substrates—the advanced platforms that allow powerful chips to connect, process, and function. As demand for AI, 5G, and other cutting-edge technologies grows, so too does the need for sophisticated substrates like those HTB3 will produce.
Standards: The Roadmap for Your Ideal Data Package
05/29/2025 | Andy Shaughnessy, Design007 MagazineIn this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
IPC Strengthens Global Focus with Promotion of Sanjay Huprikar to Chief Global Officer
05/08/2025 | IPCIPC, the global electronics association, announces the promotion of Sanjay Huprikar to chief global officer. This newly created position reflects the association’s forward-looking strategy and industry needs to strengthen the electronics supply chain.
Real Time with... IPC APEX EXPO 2025: Technological Advancements – IPC's Vision for 2025
04/16/2025 | Real Time with...IPC APEX EXPONolan Johnson introduces Matt Kelly, the CTO and VP Standards & Technology at IPC, who shares insights on recent organizational changes. He highlights the importance of proactive standards development to match the rapid pace of technology, predicting a tenfold acceleration in advancements over the next five years. IPC's core initiatives for 2025 focus on design, advanced electronics packaging, and digital manufacturing, aiming to create new guidelines and standards that meet industry demands.
Dieter Bergman IPC Fellowship Award Presented to Hiroyuki Watanabe, NEC Corporation, at IPC APEX EXPO 2025
03/24/2025 | IPCThe Dieter Bergman IPC Fellowship Award was presented to Hiroyuki Watanabe, NEC Corporation, an IPC Board Member and long-time volunteer, at IPC APEX EXPO 2025 in Anaheim, California.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved.
Log in