-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueShowing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
All About That Route
Most designers favor manual routing, but today's interactive autorouters may be changing designers' minds by allowing users more direct control. In this issue, our expert contributors discuss a variety of manual and autorouting strategies.
Creating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Indium Awards Silver Quill Honor to Authors of Cutting-Edge Technical Content
August 8, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation has honored nine of its employees for their technical industry contributions with its annual Silver Quill Award. While the company’s thought leaders present technical content at industry events throughout the year, Silver Quill provides special recognition to the most innovative and cutting-edge papers.
“Our Silver Quill Award program recognizes individuals who have authored original technical content in the form of conference papers, articles, presentations, and even blog posts,” said Indium Corporation President and COO Ross Berntson. “It acknowledges team members for generating leading-edge research and thought leadership that addresses issues faced by customers in the electronics industry. This year’s honorees are particularly deserving of the well-earned recognition.”
Two papers and their authors were recognized this year. A Bismuth-Free In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305, co-authored by Hongwen Zhang, Tyler Richmond, Kyle Aserian, Huaguang Wang, Jie Geng, Chris Nash, and Jonas Sjoberg, was first presented at ECTC 2023. The paper examines a mixed solder powder paste technology used to develop a bismuth-free, indium-containing solder paste (MTS) for lower-temperature soldering. Additionally, a paper titled Energy Consumption Reduction Using Low-Temp Solder Alloys quantifies the effect of reduced temperature on oven energy usage by recording the consumption rate of an oven under various reflow conditions. Co-authored by Adam Murling and Jay Zhang, this presentation was first delivered at APEX 2023, based on their technical paper.
Ross encouraged the authors to continue sharing their knowledge through content creation by saying, “Technical content creation is extremely important for Indium Corporation. By sharing your expertise through whitepapers, you play a crucial role in disseminating knowledge to a global audience. This effort not only excites our customer base but also positions us as an industry leader, drawing new talent and fostering a culture of continuous improvement and learning. Your contributions enable us to advance semiconductor and electronics assembly and share industry-shaping knowledge. Keep up the fantastic work, and remember that your creativity and insights bring world-changing materials science to life.”
Suggested Items
Prague PEDC: Call for Abstracts Deadline July 31
07/16/2025 | Pan-European Electronics Design Conference (PEDC)The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline is July 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
ViTrox Announces Strategic Partnership with Maxim SMT to Strengthen Presence in India
07/04/2025 | ViTroxViTrox, which aims to be the World’s Most Trusted Technology Company, is proud to announce the appointment of Maxim SMT as its new Sales Channel Partner in India, effective 1st June 2025.
CEE PCB Appoints KT Technical Solutions as North American Sales Representative
06/23/2025 | CEE PCBStrategic Partnership Expands CEE PCB’s Reach into the North American Market with a Focus on Customer-Centric Service and High-Quality Manufacturing
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
06/09/2025 | Gen3GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.
IPC Issues Call for Participation for IPC APEX EXPO 2026
06/02/2025 | IPCIPC is now accepting abstracts for technical papers with presentations, posters, and professional development courses at IPC APEX EXPO 2026.