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WestDev Announces Advanced Thermal Analysis Integration for the Pulsonix PCB Design Suite
October 29, 2025 | WestDev Ltd.Estimated reading time: 1 minute
Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software. This integration provides PCB designers with an efficient, data-consistent workflow for advanced thermal simulation and verification.
As electronic systems become smaller and more powerful, managing heat flow is critical to ensuring performance and reliability. The new Pulsonix-TRM interface bridges the gap between PCB layout and thermal analysis, enabling engineers to identify and address potential thermal issues earlier in the design process.
Streamlined Data Exchange
The Pulsonix-TRM interface allows design data to be exported directly in a TRM-compatible format, maintaining layer stack information, copper areas, vias, and component power data with full accuracy. This eliminates the need for manual data translation, reducing setup time and the risk of errors. Designers can run TRM simulation analysis, and feed results back into the PCB layout for immediate evaluation using their original PCB design.
Powerful Thermal Insight
TRM provides advanced modelling of heat conduction through multilayer PCBs, including copper planes, vias, and heat-dissipating components. Using accurate material properties and board geometries, it calculates temperature distributions, thermal resistances, and hotspot locations-helping designers optimise copper areas, cooling paths, and component placement.
Benefits for Design Teams
Integrated workflow: Smooth transition between Pulsonix PCB design and TRM thermal analysis.
- Data integrity: No intermediate file editing or geometry loss.
- Early design validation: Thermal risks identified and resolved before prototype stage.
- Improved reliability: Better prediction of heat flow and temperature gradients.
“Thermal behaviour has become a key constraint in modern electronics,” said Bob Williams, Marketing Director at WestDev Ltd. “By linking Pulsonix directly with TRM, we're giving designers immediate access to accurate thermal insight-without leaving their familiar environment.”
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
GEN3 Systems to Showcase Advanced Reliability Test Solutions at productronica 2025 in Munich
10/29/2025 | Gen3 SystemsGEN3 a leader in innovative reliability test solutions, is excited to announce its participation at productronica 2025, the world’s premier trade fair for electronics development and production.
Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
10/28/2025 | John Watson -- Column: Elementary, Mr. WatsonIf electricity were a group of college students, then power electronics and the PCB designers who dive into it would insist on driving the car on every road trip because they know the car inside and out—they’re the students with jumper cables in the trunk, a tire pressure gauge in the glove box, and snacks stashed under the seat. While the others argue over playlists and directions, power electronics is busy ensuring the alternator doesn’t fry, the headlights don’t dim, and everyone reaches the destination with fuel still in the tank.
Small Material, Big Impact: IDTechEx Explores Graphene in Electronic Applications
10/27/2025 | IDTechExGraphene was initially celebrated as a sci-fi material destined to transform electronics, quantum devices, and futuristic sensors. While expectations soared, commercial reality proved more modest.
Peters Spotlights Heatsink Paste at productronica
10/22/2025 | PetersThe ELPEPCB HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.
Indium Expert to Present on Advancing Thermal Performance at TestConX China
10/21/2025 | Indium CorporationIndium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).