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INSPECTIS’ Extended Reach BGA-XL Stand for Larger PCBAs Joins Higher Magnification XM Lenses
September 23, 2024 | INSPECTISEstimated reading time: 1 minute
Ultra-low clearance BGAs on large PCBAs are no problem to optically inspect now, because INSPECTIS’ BGA-XL stand will reach them, while optional new XM lenses will get you under them – offering up to 285x screen magnification.
In making the announcement, Alistair Gooch, Marketing Manager, said, “Our unique XM lens for our BGA inspection systems is a remarkable feature that is especially designed for small stand offs, e.g., 200 microns, and very small ball arrays. What’s more, when coupled with our new extended reach BGA-XL stand for larger boards, we are supplying greater reach, power, and capability. Our advanced and configurable capabilities in the field of optical BGA inspection can be applied to finding solutions where others cannot!”
The INSPECTIS BGA lens package consists of a lens (standard or XM) plus a probe tip (standard or small), and the new XM higher power lens is compatible with both the Standard and the Small probe tip, which features a 27% smaller footprint. Inspectis offers a wide range of packages/sets covering basic or advanced inspection requirements.
“This unique side-view BGA Inspection system features the tiniest and most robust optical probe available, with built-in high power lighting and a crisp, sharp high-resolution 90-degree viewing angle. Plus, we have recently made mechanical improvements to various aspects of the BGA camera stand, based on customer feedback that makes the platform more stable, and improves the mechanism that reduces the risk of prism damage.”
The INSPECTIS BGA Inspection System is available in 2 system levels, Basics and ProX which includes powerful INSPECTIS BGA Inspection, analysis, and documentation software.
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Altus Group Introduces Innovative BGA Reballing Solution to Meet Growing Sustainability Demands
09/25/2024 | Altus GroupAltus Group, a leading distributor of capital equipment in the UK and Ireland, has introduced an advanced BGA re-balling solution to address the electronics industry's growing focus on sustainability and cost-efficiency.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
Cost-optimize Your PCB Design and Specifications
08/20/2024 | Erik Pedersen and Richard Koensgen, ICAPE GroupKnowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.
Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle
08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion LaboratoryCurrent trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.
Innovative and Cost-effective BGA Re-balling
07/23/2024 | Shavi Spinzi, Nano Dimension/EssemtecA new, high-quality BGA re-balling process, which is integrated into an all-in-one solution of dispensing and placement equipment developed by Essemtec, brings new opportunities for the reapplication of expensive BGA components. This new method seamlessly integrates the sequence of flux deposition and ball (sphere) placement with the subsequent soldering process.