Elementary, Mr. Watson DFX—Basically a Basket of Crabs With Spreadsheets
Connect the Dots: Designing for the Future of Manufacturing Reality—Solder Mask and Legend
Target Condition: An Exploration of Flooding PCB Layers
Department of Defense Awards $30 Million to Expand Domestic Printed Circuit Board and Substrate Production
October 1, 2024 | U.S. Department of DefenseEstimated reading time: 1 minute
The Department of Defense announced today a $30 million award to TTM Technologies Inc. (TTM) in Santa Ana, California. This award, facilitated through the Defense Production Act Purchases (DPAP) office, will enable TTM to acquire and install advanced manufacturing equipment and develop prototype designs for printed circuit boards. The project will commence at TTM's Centers of Excellence across the United States, ultimately culminating in integration into its new Syracuse, New York facility. This strategic initiative aims to enhance TTM's capabilities and enable the timely delivery of cutting-edge technology to support vital defense programs.
"The DoD requires state-of-the-art advanced printed circuit board manufacturing capability to support defense programs," said Dr. Laura Taylor-Kale, Assistant Secretary of Defense for Industrial Base Policy (ASD(IBP)). "This project provides domestic manufacturing capabilities to meet demand for current and future U.S. systems."
"This $30 million investment will help enable TTM to build a new 200,000+ square foot facility, significantly increasing domestic production of ultra-high density printed circuit boards and bolstering supply chain resilience in line with the 2024 National Defense Industrial Strategy," added Mr. Anthony Di Stasio, Director of the Manufacturing Capability Expansion and Investment Prioritization (MCEIP) directorate within OASD(IBP).
This was the 70th award the DPAP program issued across multiple areas in Fiscal Year 2024, for a total value of $672 million. The DPAP office is overseen by the MCEIP directorate.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
OE‑A Publishes 10th Edition of the Roadmap for Flexible and Printed Electronics
04/22/2026 | OE-AWith the publication of the 10th edition of the “OE-A Roadmap for Flexible and Printed Electronics,” the OE-A, an international working group for printed electronics within the VDMA, once again presents the central guidance and reference document for the industry.
Kitron Secures EUR 37 Million Order for Next-Generation Tactical Communication Equipment
04/22/2026 | KitronKitron has secured an order valued at approximately EUR 37 million for the production and supply of advanced radio systems used in tactical mobile platforms.
The Right Approach: The End of an Era—DoD Proposes MIL-PRF-31032 Cancellation
04/21/2026 | Steve Williams -- Column: The Right ApproachThe Defense Logistics Agency has initiated formal proceedings to cancel the military's primary performance specification for printed circuit boards, a move that could reshape how the U.S. defense industrial base qualifies and sources one of its most critical electronic components. On March 4, 2026, DLA Weapons Support issued a memorandum to military and industry coordination activities announcing that MIL-PRF-31032, along with its six associated specification sheets, has been proposed for cancellation. A 30-day comment period was allotted, with concurrence or comments due by April 3, 2026.
Spirit Electronics Named Authorized Distributor for Microchip Technology
04/17/2026 | Globe NewswireSpirit Electronics, a vertically integrated electronics design and manufacturing solutions provider serving the military and aerospace markets, announced that it has been designated as an authorized distributor for the Americas for Microchip Technology, a broadline supplier of semiconductors committed to making innovative design easier through total system solutions.
Teledyne FLIR Defense Wins $35+ Million Surveillance System Contract for Reconnaissance Vehicles
04/17/2026 | BUSINESS WIRETeledyne Technologies Incorporated announced that Teledyne FLIR Defense has been awarded a contract worth more than $35 million by WB Electronics S.A. (part of the WB Group) to equip reconnaissance vehicles with TacFLIR® 280-HDEP medium range multi-spectral surveillance systems.