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New Information Now Available for Popular Podcast Series on PCB Design
October 24, 2024 | I-Connect007Estimated reading time: 1 minute
Exciting news for listeners of On the Line With... PCB 3.0: A New Design Methodology, the popular podcast series hosted by I-Connect007. A 10-page companion guide featuring insights from Cadence's subject matter experts is now available for download.
The world of PCB design is undergoing a remarkable transformation. While advancements in AI, 3D printing, and innovative materials are reshaping the landscape, the industry also faces the challenge of a retiring generation of veteran designers. In this era of change, the need for smarter, faster, and more cost-effective design methodologies has never been greater.
Discover how Cadence is addressing these evolving demands by visiting our podcast page. There, you'll find insightful content, including episodes like “Why Do We Need to Change,” “How Will AI Play a Role,” and “More Power to the EE,” offering valuable perspectives on the future of PCB design.
At I-Connect007, we're committed to delivering valuable content that supports the global electronics community. From magazines, books, and newsletters to podcasts, market reports, and event coverage, we offer diverse resources to help you thrive in the industry.
As the longest-running digital media company in the electronics supply chain, I-Connect007 continues to provide exclusive, high-quality content.
We hope you enjoy the PCB 3.0: A New Design Methodology podcast series and its companion guide.
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New Podcast Episode: “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics”
11/05/2025 | I-Connect007I-Connect007 has released of a new episode in its Voices of the Industry podcast series, titled “Bonding Innovation: How Adhesives and Coatings Are Powering the Next Generation of Electronics.” Hosted by Nolan Johnson, this insightful discussion dives deep into the evolving world of adhesives and coatings—materials that are redefining performance, reliability, and design in modern electronics manufacturing. Dymax's Doug Katze, a leading expert in adhesive technologies, delivers what can only be described as a master class on how these critical materials are adapting to meet rapidly changing market demands.
Target Condition: Distribution of Power—Denounce the Ounce
11/05/2025 | Kelly Dack -- Column: Target ConditionHave you ever wondered why the PCB design segment uses ounces to describe copper thickness? There’s a story behind all of this—a story that’s old, dusty, and more than a little absurd. (Note that I didn’t add “Like many of us.”) Legend has it that back in the days of copper tinkers and roofing tradesmen, the standard was set when a craftsman hammered out a sheet of copper until it weighed one ounce, when its area conveniently matched the square of the king’s foot.
NEDME 2025 Draws Strong Northwest Crowd, Builds on Tradition of Regional Collaboration
10/31/2025 | NEDMEThe NW Electronics Design & Manufacturing Expo (NEDME) 2025 once again brought together the Pacific Northwest community for a full day of learning, networking, and industry connections.
Keysight Advances Quantum Engineering with New System-Level Simulation Solution
10/30/2025 | BUSINESS WIREKeysight Technologies, Inc. announced the release of Quantum System Analysis, a breakthrough Electronic Design Automation (EDA) solution that enables quantum engineers to simulate and optimize quantum systems at the system level.
WestDev Announces Advanced Thermal Analysis Integration for Pulsonix PCB Design Suite
10/29/2025 | WestDev Ltd.Pulsonix, the industry-leading PCB design software from WestDev Ltd., announced a major enhancement to its design ecosystem: a direct interface between Pulsonix and ADAM Research's TRM (Thermal Risk Management) analysis software.