Global Citizenship: Comparing and Contrasting the U.S. and China PCB Industries
Standard of Excellence: Finding and Hiring the Right Candidates for Engineering Positions
Global Sourcing Spotlight: 10 Rules of the Game
Root-cause Analysis and Problem-solving
November 1, 2024 | Happy Holden, I-Connect007Estimated reading time: Less than a minute
An essential skill for any process engineer in printed circuit fabrication is the ability to conduct root-cause analysis (RCA) and problem-solving. These are related to TQC and Six Sigma applications and are essential for customer support and continued profitability. All engineers will encounter these methods sooner or later, but it will likely be sooner if you are in product or process engineering in manufacturing.
I started my career in IC fabrication at Hewlett-Packard after serving in the Army and completing my graduate studies. In 1970, I was asked to help the PCB fabrication team members with some of their technical problems. I had two tools that most engineers in the PCB plant didn’t have at that time: engineering statistics, including design of experiments (DOE), and experience with problem-solving (TQC).
To read this entire article, which appeared in the October 2024 issue of PCB007 Magazine, click here.
Share on:
Suggested Items
Real Time with... SMTAI 2024: Summit Interconnect Doing Its Part to Rebuild Industry Expertise
10/29/2024 | Real Time with...SMTAIIn this interview from the recent SMTAI show, Nolan Johnson speaks with Jesse Vaughan from Summit Interconnect. Jesse hits the highlights for some of Summit's programs to promote skilled workers in our industry—programs such as apprenticeships, Emerging Engineers, and more.
Designers Notebook: Implementing HDI and UHDI Circuit Board Technology
10/23/2024 | Vern Solberg -- Column: Designer's NotebookTo accommodate new generations of high I/O semiconductor packaging, circuit board technology has undergone significant changes in both the fabrication process method and the criteria for base material selection. The reason behind these changes is the new high-function semiconductor package families that require more terminals than their predecessors and a significantly narrower terminal pitch.
Introducing the Ultra HDI Learning Pavilion at SMTA International 2024
10/07/2024 | SMTAThe SMTA is thrilled to announce the launch of the Ultra HDI (UHDI) Learning Pavilion, a first-of-its-kind experience dedicated to advancing Ultra-High Density Interconnect technology.
Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4
09/25/2024 | I-Connect007 Editorial TeamDirect-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.
Routing, Final Fab, and QC: Don’t Miss the Final Episode of On the Line With… Designing for Reality
09/23/2024 | I-Connect007Don't miss the final episode of "On the Line With… Designing for Reality," in which ASC Sunstone General Manager Matt Stevenson wraps up his deep dive into the PCB manufacturing process with a discussion of Routing, Final Fabrication, and Quality Control.